Results 151 to 160 of about 118,363 (309)

Microstructure, Thermal Transport, and Dry‐Sliding Tribology of Powder‐Metallurgy Al7075 Composites Reinforced With Sol–Gel‐Derived ZnO–rGO Hybrid Nanoparticles

Advanced Engineering Materials, EarlyView.
Sol–gel‐derived ZnO–rGO hybrid nanoparticles enable Al7075 powder‐metallurgy composites to achieve concurrent gains in hardness and thermal conductivity while markedly lowering friction and wear. The hybrid architecture couples ZnO‐based load support with rGO‐assisted lamellar sliding and heat spreading, revealing a promising route toward lightweight ...
Bunyamin Aksakal, Cevher Kursat Macit, Merve Ayık, Hakan Tutumlu   +3 more
wiley   +1 more source

Enhanced load frequency control using a novel fractional-order integral-integral-derivative controller optimized by cuckoo catfish optimizer. [PDF]

Sci Rep
Barakat M, Donkol A, Sekhi M, Mabrouk AM.   +3 more
europepmc   +1 more source

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

Advanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow, Samya Sen, Joaquin Yus, Eliza E. Lovrich, Amanda G. Hoika, Kelly M. Chang, Arielle A. Pfeil, Nellie Haug, Amy J. Wagoner Johnson, Randy H. Ewoldt   +9 more
wiley   +1 more source

Passive cooling garments for outdoor thermal adaptation: a field experiment. [PDF]

Int J Biometeorol
Shimazaki Y, Tominaga N, Yuan J, Adachi M, Putra N, Tajima M.   +5 more
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Energy Performance And Long-Term Evaluation Of Internal Thermal Comfort Of An Office Building With Different Kinds Of Glazing Systems And Window Sizes

, 2012
Although the presence of large window surfaces could be preferable during the heating season when solar gains through the glazed components can overcome heating losses from the same surfaces, during the cooling season more attention has to be paid in ...
Gasparella, Andrea, Pernigotto, Giovanni, Giovanni PERNIGOTTO, Romagnoni, Piercarlo, Andrea GASPARELLA, Cappelletti, Francesca   +5 more
core  

Research Progress in the Evaluation of Thermal Shock Resistance of Refractories: From Theoretical Evolution to Intelligent Characterization. [PDF]

Materials (Basel)
Wang G, Ren B, Liu J, Wang E, Hou X, Chen M.   +5 more
europepmc   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Development and Characterization of Agar-Starch-Based Bioplastic Films. [PDF]

Polymers (Basel)
Alnatsheh A, Dikici B, Srinivasaraghavan Govindarajan R, Kim D.   +3 more
europepmc   +1 more source

Data Raduction of Thermal Balance Test of Spacecraft

Journal of the Japan Society for Aeronautical and Space Sciences, 1970
TAKAHASHI, Harumi, OSHIMA, Koich
openaire   +2 more sources