Results 21 to 30 of about 203,544 (317)

Thermal and exergetic analysis of Metal Foam-enhanced Cascaded Thermal Energy Storage (MF-CTES) [PDF]

open access: yes, 2013
Metal Foam-enhanced Cascaded Thermal Energy Storage (MF-CTES) has been proposed to solve the problem of poor heat transfer during heat exchange process, which is caused by unavoidable decrease of temperature differences. This paper conducts a theoretical
Zhao, Changying   +3 more
core   +1 more source

Fast Calculation of Transient Thermal Stress in Surge Lines with Thermal Stratification Region

open access: yesApplied Sciences, 2021
Nuclear power plants applying for license renewal are required to undertake a fatigue assessment of various components, which demands the fast calculation of transient thermal stress of the fatigue-sensitive components such as surge lines. In this study,
Bingjun Gao   +3 more
doaj   +1 more source

Work verification of the energy steam boiler evaporator in the Power plant 'Kostolac B' [PDF]

open access: yesFME Transactions, 2012
Within Electric Power Utility of Serbia 1991, a thermal power plant 'Kostolac B', power 2 × 350 MW, started. Based on the examination of steam boiler pipe system, it is confirmed that it is in a 'bad' shape.
Stupar Goran   +3 more
doaj  

THE WAYS OF INCREASE OF EFFICIENCY OF FOAM CONCRETE

open access: yesВестник Дагестанского государственного технического университета: Технические науки, 2016
Aim. The analysis of the using common wall materials for a given heat resistance is presented in the article.Methods. In the result of thermal calculation of multilayer walls is shown that to ensure the required resistance of heat transfer is more ...
Sh. G. Jalalov, K. A. Otsokov
doaj   +1 more source

THERMAL CALCULATION OF THE RECTIFIER

open access: yes, 2022
A rectifier is an electrical device that converts alternating current (AC), which periodically changes direction, into direct current (DC), which flows in only one direction. Three-phase rectifiers make it possible to obtain large amounts of direct currents with low levels of output voltage ripples, which affects the reduction of requirements for the ...
openaire   +2 more sources

Improved Thermal Network Method for Fuel Transient Temperature Prediction of High-Speed Aircrafts

open access: yesShanghai Jiaotong Daxue xuebao, 2023
The low simulation efficiency of three-dimensional transient calculation makes it difficult to be applied in predicting fuel temperature during the entire fuel consumption process.
CHENG Xianda, ZHENG Haoran, YANG Xuesen, DONG Wei
doaj   +1 more source

Thermal comfort conditions in airport terminals: Indoor or transition spaces? [PDF]

open access: yes, 2016
This paper reports on the investigation of the thermal comfort conditions in three airport terminals in the UK. In the course of seasonal field surveys, the indoor environmental conditions were monitored in different terminal areas and questionnaire ...
Kotopouleas, Alkis   +1 more
core   +1 more source

Investigation of the thermal field in micro friction surfacing [PDF]

open access: yes, 2010
To model the thermal response of the micro friction surfacing process with complex geometries and to tackle transient deposition processes, suitable numerical methods have been developed.
Javaid, N., Vitanov, V. I.
core   +1 more source

Thermal time in sprinkler-irrigated lowland rice [PDF]

open access: yesPesquisa Agropecuária Brasileira, 2017
: The objective of this work was to evaluate methods of thermal time calculation and the duration of the development stages of lowland rice (Oryza sativa) irrigated by sprinkling. The experiment was conducted during three growing seasons (2010/2011, 2011/
Alex Cristiano Bartz   +7 more
doaj   +1 more source

Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits

open access: yesIEEE Access, 2023
This paper applies the carbon materials (i.e., SWCNT, MWCNT, and GNR) as new prospective filler materials of through silicon vias (TSV) for replacing the conventional copper (Cu) to improve the thermal performance of three-dimensional integrated circuits
Peng Xu   +3 more
doaj   +1 more source

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