Results 221 to 230 of about 462,222 (297)

Homogenized thermal conduction model for particulate foods

, 2002
Francisco Chinesta, Rafael Torres, Antonio Ramon, Mari Carmen Rodrigo, M. Isabel Rodrigo   +4 more
openalex   +2 more sources

Enhancing Corrosion Resistance and Mechanical Strength of 3D‐Printed Iron Polylactic Acid for Marine Applications via Laser Surface Texturing

Advanced Engineering Materials, EarlyView.
Laser surface texturing significantly improves the corrosion resistance and mechanical strength of 3D‐printed iron polylactic acid (Ir‐PLA) for marine applications. Optimal laser parameters reduce corrosion by 80% and enhance tensile strength by 25% and ductility by 15%.
Mohammad Rezayat, Mojtaba Karamimoghadam, Mohammadreza Lalegani Dezaki, Ali Zolfagharian, Giuseppe Casalino, Antonio Mateo, Mahdi Bodaghi   +6 more
wiley   +1 more source

Modelling hyperbolic heat conduction in a finite medium with periodic thermal disturbance and surface radiation

, 2003
Ching-Chuan Yen, Chih-Yang Wu
openalex   +1 more source

ALD‐Assisted VO2 for Memristor Application

Advanced Engineering Materials, EarlyView.
This work demonstrates a strategy for depositing VOx using thermal atomic layer deposition (ALD) followed by thermal annealing to synthesize VO2. The thin film and core/shell wire memristors exhibit excellent switching performance and are highly sensitive to ambient temperature.
Jun Peng, Daniel Hensel, Rakshith Venugopal, Lucas Rave, Colin Schormann, Sebastian Koch, Robert H. Blick, Robert Zierold   +7 more
wiley   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

Advanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

High‐Entropy Ti, Zr, Hf, Ta Multiphase Diboride with Deformation Resistance up to 2000 °C

Advanced Engineering Materials, EarlyView.
Ceramics are brittle and strength decreases with temperature. The multiphase high‐entropy (Ti0.25Ta0.25Hf0.25Zr0.25)B2 with heterogeneity at the nano‐ and microscale demonstrates deformation resistance up to 2000 °C, with maximum bending strength at 1800 °C.
Petre Badica, Mihai Alexandru Grigoroscuta, Andrei Cristian Kuncser, Oleg Vasylkiv   +3 more
wiley   +1 more source

Limits on thermal conduction in galaxy clusters

, 2003
Mikhail V. Medvedev, Adrian L. Melott, C. J. Miller, D. Horner   +3 more
openalex   +2 more sources

Influence of an Al‐Doped ZnO Interface Layer on the Thermochromic Properties of VO2 Thin Films Deposited by RF Magnetron Sputtering

Advanced Engineering Materials, EarlyView.
Herein the metal‐to‐insulator transition is investigated when depositing vanadium dioxide (VO2) on glass or aluminum‐doped zinc oxide (AZO). O2 flow tuning during the deposition and additional post annealing are effective to control the metal‐to‐insulator transition. However, the VO2/AZO/glass stack reveals an increase in the transition temperature and
Eduard Llorens Balada, Evgeniy Shkondin, Stela Canulescu, Eugen Stamate   +3 more
wiley   +1 more source

Direct Consolidation of Copper–Graphene Composite by Rotary Swaging

Advanced Engineering Materials, EarlyView.
The applicability of the rotary swaging method for preparation of electroconductive copper–graphene composite by direct consolidation of powders is proven. The consolidated material features advantageous microstructure featuring fine grains and twins, with homogeneous distribution of graphene, primarily along the twin boundaries, which contribute to ...
Radim Kocich, Lenka Kunčická, Pavel Czernek   +2 more
wiley   +1 more source

MOLECULAR DYNAMICS SIMULATION OF THERMAL CONDUCTION IN NANOPOROUS THIN FILMS

, 2004
Jennifer R. Lukes, C. L. Tien
openalex   +2 more sources