Results 111 to 120 of about 3,683,208 (347)

Quality Enhancement of Laser Powder‐Bed Fusion Parts by Acoustically Assisted Additive Manufacturing by Laser Powder‐Bed Fusion and its Application to Lattice Structures

open access: yesAdvanced Engineering Materials, EarlyView.
Additive manufacturing technologies like laser powder‐bed fusion offer great design freedom and individualization of products down to a batch size of one. However, parts fabricated with this technology suffer from poor quality. Acoustic assistance during the build process can minimize these drawbacks.
Oliver Maurer, Dirk Bähre
wiley   +1 more source

A Simulative Approach for the Prediction of Mesoscale Residual Stress Fields in Solution‐Strengthened Ferritic Ductile Iron

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach   +6 more
wiley   +1 more source

Mechanical Behavior and Microstructural Changes Associated with Tensile Deformation above the Martensite Start Temperature during Quenching and Subsequent Partitioning of a Low‐Alloy 37SiB6 Steel

open access: yesAdvanced Engineering Materials, EarlyView.
A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen   +4 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

High‐Temperature Oxidation of the CrFeNi Medium‐Entropy Alloy

open access: yesAdvanced Engineering Materials, EarlyView.
The oxidation behavior of equiatomic CrFeNi MEA is a key issue that determines this material's suitability for high‐temperature application. The understanding of long‐term behavior is even more crucial than short‐term corrosion effects. The alloy is exposed to synthetic air at 1000, 1050, and 1100 °C for 24, 100, and 1000 h and systematically compared ...
Anna Maria Manzoni   +5 more
wiley   +1 more source

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