Results 181 to 190 of about 774,147 (338)
Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V
Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena +2 more
wiley +1 more source
High sensitivity SAW hydrogen gas sensor based on thermal conductivity effect. [PDF]
Cui B +6 more
europepmc +1 more source
The formation of nonmetallic inclusions (NMIs) was investigated in this study, carrying out immersion tests for 30 min at a temperature of 1600°C with liquid high‐silicon electrical steel (Si ≈ 3 mass‐%) and different MgO–C refractories. Conventional MgO–C refractories were considered, as well as MgO–C refractories containing MgO–C recyclate and ...
Lukas Neubert +6 more
wiley +1 more source
Improving the Thermal Conductivity by Varying the Filler Geometry of Copper in Thermosets. [PDF]
Rösel U, Drummer D.
europepmc +1 more source
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
Oil-Based Phase Change Emulsions Endowed with High Thermal Conductivity and Responsive Rheological Behavior. [PDF]
Qian Y, Wang Q, Zhao Y, Li Z.
europepmc +1 more source
Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions
This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel +6 more
wiley +1 more source
Topochemical Reaction Induces Anisotropy, Decreasing Solid-State Thermal Conductivity. [PDF]
Atassi A +10 more
europepmc +1 more source
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source

