Results 81 to 90 of about 3,193,604 (289)

THE TEMPERATURE DEPENDENCE OF UNSTEADY HEAT CONDUCTION IN SOLIDS

open access: yesРоссийский технологический журнал, 2019
A mathematical model of the process of unsteady thermal conductivity of solids is proposed in the case where the dependence of the thermal characteristics of the medium (heat capacity, density and thermal conductivity coefficient) on temperature cannot ...
L. M. Ozherelkova, E. S. Savin
doaj   +1 more source

Controlling Grain Growth in Powder Bed Fusion of Yttria‐Stabilized Zirconia Using Femtosecond Lasers: Challenges and Methodological Insights

open access: yesAdvanced Engineering Materials, EarlyView.
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn   +5 more
wiley   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

open access: yesAdvanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz   +4 more
wiley   +1 more source

Measurement of thermal conductivity using 2D inverse heat conduction problem approach by identifying simultaneously the heat dissipation phenomena

open access: yesCase Studies in Thermal Engineering
Various methods for measuring thermal conductivity have been applied under both steady-state and transient conditions. A challenge in thermal conductivity measurement lies in accurately identifying the heat dissipated to the environment.
Ari Satmoko   +7 more
doaj   +1 more source

Influence of TiC and TiN Ceramic Reinforcements on the Microstructure, Thermal Expansion Behavior, and Tensile Properties of Invar 36 Manufactured by Laser Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji   +3 more
wiley   +1 more source

On the experimental investigation of the rotational coefficients of thermal conductivity [PDF]

open access: yesThe London, Edinburgh, and Dublin Philosophical Magazine and Journal of Science, 1894
n ...
openaire   +2 more sources

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

open access: yesAdvanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Thermal Conductivity Coefficient from Microscopic Models

open access: yes, 2016
Thermal conductivity of hadron matter is studied using a microscopic transport model, which will be used to simulate ultra-relativistic heavy ion collisions at different energy densities, namely the Ultra-relativistic Quantum Molecular Dynamics (UrQMD). The molecular dynamics simulation is performed for a system of light mesons species (pion, rho, kaon)
Nemakhavhani, T. E, Muronga, A.
openaire   +2 more sources

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

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