Results 141 to 150 of about 1,651,680 (347)

Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V

Advanced Engineering Materials, EarlyView.
Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena, Benjamin Bergmann, Michael Zenger   +2 more
wiley   +1 more source

Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

Micromachines
A four-tether silicon microthermocycler for point-of-care PCR analytical systems is proposed. Substituting the commonly employed platinum with titanium in the fabrication of thin film resistance temperature detectors and heaters enabled the realization ...
Borut Pečar, Aljaž Zadravec, Danilo Vrtačnik, Matej Možek   +3 more
doaj   +1 more source

Population of Nonmetallic Inclusions in Liquid High‐Silicon Electrical Steel in Contact With MgO–C Refractories Based on Recyclates and Environmentally Friendly Binders

Advanced Engineering Materials, EarlyView.
The formation of nonmetallic inclusions (NMIs) was investigated in this study, carrying out immersion tests for 30 min at a temperature of 1600°C with liquid high‐silicon electrical steel (Si ≈ 3 mass‐%) and different MgO–C refractories. Conventional MgO–C refractories were considered, as well as MgO–C refractories containing MgO–C recyclate and ...
Lukas Neubert, Matheus Roberto Bellé, Florian Kerber, Dinesh Kumar Gunasekar, Hans‐Jörn Weddige, Christos G. Aneziris, Olena Volkova   +6 more
wiley   +1 more source

Decay of the cosmological constant: Equivalence of quantum tunneling and thermal activation in two spacetime dimensions [PDF]

, 2005
Andrés Gomberoff, Marc Henneaux, Claudio Teitelboim   +2 more
openalex   +1 more source

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions [PDF]

, 2022
Dilara Arıbuğa, Ufuk Akkaşoğlu, Buğra Çiçek, Özge Balcı   +3 more
openalex   +1 more source

Al–Cu Composite Casting of Laser‐Deoxidized Copper: Bonding, Interfacial Chemistry, and Thermal Conductivity

Advanced Engineering Materials, EarlyView.
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff, Finn‐Lennard Janthur, Sascha Zimmermann, Sarah Seffer, Jörg Hermsdorf, René Gustus, Ludger Overmeyer, Wolfgang Maus‐Friedrichs, Hans Jürgen Maier, Christian Klose   +9 more
wiley   +1 more source

Kapitza Length at Solid–Liquid Interface: From Nanoscale to Microscale

Small Science
Understanding thermal energy transport at solid–liquid interfaces is critical for enhancing the performance of nano‐ or microscale systems. Although extensive studies have addressed the interfacial thermal resistance, known as Kapitza length, its impact ...
Wentao Chen, Gyoko Nagayama
doaj   +1 more source

Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions

Advanced Engineering Materials, EarlyView.
This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel, Lara Kuhr, Khemais Barienti, Sebastian Herbst, Florian Nürnberger, Hans Jürgen Maier, Marc C. Wurz   +6 more
wiley   +1 more source

Transverse temperature distributions and heat generation rate in composite conductors subjected to a constant thermal disturbance

, 1994
Y.S. Cha
openalex   +2 more sources

Investigation of Oxygen‐Free Wetting Behavior of Aluminum on Copper via Molecular Dynamics Simulations and Experiments

Advanced Engineering Materials, EarlyView.
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu, Timon Steinhoff, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Christian Klose, Ludger Overmeyer, Hans‐Jürgen Maier, Nina Merkert   +8 more
wiley   +1 more source