Results 21 to 30 of about 119,785 (262)
Thermal Resistance Distribution Experiment of Parallel Sub-Module in Press-Pack IGBT Device
Zhongguo dianli, 2020 In the rigid Press-Pack IGBT module, the pressure distribution of parallel chips determines the contact thermal resistance and contact electrical resistance directly.
Lubin HAN, Lin LIANG, Yong KANG
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Nanomaterials, 2021 Given the thermal management problem aroused by increasing power densities of electronic components in the system, graphene-based papers have raised considerable interest for applications as thermal interface materials (TIMs) to solve interfacial heat ...
Jingyao Gao +14 more
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工程科学学报, 2015 Heat-pipe-cooled thermal protection is an effective thermal protection method with embedded high heat transfer capacity materials or structures. A numerical model of a heat-pipe-cooled thermal protection structure with an embedded high thermal conduc ...
LIU Dong-huan +2 more
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Solid chamber for satellite electronic modules and evaluation of its heat conduction behavior
Case Studies in Thermal Engineering, 2023 A novel solid chamber configuration for cooling satellite electronic modules enduring high heat is proposed. Solid chamber modules with different inner structures and solid materials with high thermal conductivity are designed, and their thermal ...
Haoyue Cheng +6 more
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The thermal contact resistance of a steel-ceramic interface with oxide intermediates
Cogent Engineering, 2020 Metal structures covered by refractories are widely employed in high temperature processes such as incineration and metal production. The thermal resistance in refractories used in high temperature processes is associated with different phases, phase ...
Jussi Silvonen +2 more
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Effect of Contact Pressure on the Performance of Carbon Nanotube Arrays Thermal Interface Material
Nanomaterials, 2018 Vertically aligned carbon nanotube (CNT) arrays are promising candidates for advanced thermal interface materials (TIMs) since they possess high mechanical compliance and high intrinsic thermal conductivity.
Yu Pei +4 more
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Reduction of interface thermal resistance between TIM and metal surface by tuning wettability
Nihon Kikai Gakkai ronbunshu, 2021 Thermal management of electronics is becoming demanding with the miniaturization of integrated circuit and the shift to next-generation high-power electronics.
Yusuke IRA +2 more
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Reconstructing enzyme evolution by protein engineering
FEBS Letters, EarlyView.Natural enzyme evolution can be retraced by protein engineering methods such as directed evolution, rational design, and ancestral sequence reconstruction. These approaches reveal how enzymes emerged from ligand‐binding scaffolds, developed varying substrate preferences, formed oligomeric complexes, adapted to environmental changes, and evolved novel ...
Lukas Drexler +2 more
wiley +1 more source
The Numerical Estimation of Thermal Contact Resistance in Contacting Surfaces [PDF]
American Journal of Applied Sciences, 2008 For some manufacturing processes, the heat transfer between the components, the tools and the environment has an effect on tool-life and the accuracy of the formed component. Consequently, the measurement of Thermal Contact Resistance (TCR) is of increasing interest to researchers and industrial engineers participating in the manufacture of high ...
M.H. Shojaefard, K. Goudarzi
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Molecular Oncology, EarlyView.The novel styrylquinazolinone‐based molecule W1B effectively suppresses glioblastoma by inhibiting IGF1R and EGFR. In high‐glucose microenvironments driving tumor resistance, W1B acts synergistically with the EGFR inhibitor dacomitinib. This combination safely blocks compensatory survival signaling in zebrafish xenograft models. Showcasing promising in
Patryk Rurka +9 more
wiley +1 more source