Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction [PDF]
Nano-Micro Letters, 2022 Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides).
Wen Dai +15 more
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Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics [PDF]
Nanomaterials, 2022 With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area.
Wenkui Xing +3 more
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Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance [PDF]
Nanomaterials, 2021 We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends
Sriharsha Sudhindra +2 more
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Graphene-Assisted Thermal Interface Materials with a Satisfied Interface Contact Level Between the Matrix and Fillers [PDF]
Nanoscale Research Letters, 2018 Reduced graphene oxide (RGO) and three-dimensional graphene networks (3DGNs) are adopted to improve the performance of thermal interface materials (TIMs). Therein, the 3DGNs provide a fast transport network for phonons, while the RGO plays as a bridge to
Bo Tang +4 more
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Materials & Design, 2021 With the development of electronic technologies, electronic devices become smaller, while their power density increases dramatically. The resulting excessive heat requires excellent heat dissipation to ensure great performance of the devices.
Xiaoxiao Guo +4 more
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Thermal interface materials: From fundamental research to applications
SusMatThe miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering ...
Baojie Wei +7 more
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Research progress of methods to reduce solid-solid contact thermal resistance [PDF]
Journal of Hebei University of Science and Technology, 2023 Reducing solid-solid interface contact thermal resistance is an efficient and widely used method for reducing heat transfer resistance in devices. Increasing the effective contact of the interface according to the solid-solid interface state can enhance ...
Qingsong SONG +3 more
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Effect of Post-Deposition Thermal Treatments on Tensile Properties of Cold Sprayed Ti6Al4V
Metals, 2022 This study aims at investigating the effect of various post-deposition thermal treatments on improving tensile properties of cold spray (CS) deposited titanium alloy Ti6Al4V.
Dibakor Boruah +4 more
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Research progress of diamond/aluminum composite interface design
Functional Diamond, 2022 Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management.
Zengkai Jiao +9 more
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Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects
IEEE Open Journal of Nanotechnology, 2022 We provide a summary of the fundamentals of thermal management, outline the state-of-the-art in the field of thermal interface materials, and describe recent developments in graphene-based non-curing and curing composites used for thermal management. The
Sriharsha Sudhindra +2 more
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