Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction [PDF]
Nano-Micro Letters, 2022 Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides).
Wen Dai +15 more
doaj +3 more sources
Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics [PDF]
Nanomaterials, 2022 With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area.
Wenkui Xing +3 more
doaj +2 more sources
Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance [PDF]
Nanomaterials, 2021 We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends
Sriharsha Sudhindra +2 more
doaj +2 more sources
Graphene-Assisted Thermal Interface Materials with a Satisfied Interface Contact Level Between the Matrix and Fillers [PDF]
Nanoscale Research Letters, 2018 Reduced graphene oxide (RGO) and three-dimensional graphene networks (3DGNs) are adopted to improve the performance of thermal interface materials (TIMs). Therein, the 3DGNs provide a fast transport network for phonons, while the RGO plays as a bridge to
Bo Tang +4 more
doaj +2 more sources
Thermal interface composite polymer materials
Авіаційно-космічна техніка та технологіяThe subject of the article is the analysis and development of new thermally conductive composite polymer materials used for improved heat dissipation in electronics.
Oleksandr Listratenko +4 more
doaj +2 more sources
Investigation of thermal transport across volume-controlled thermal interface materials
Polymer TestingFor thermal management, thermal interface materials are essential to reduce parasitic thermal resistance by filling microscopic gaps at interface. While much of previous research has focused on enhancing the thermal conductivity of the materials, the ...
Jungmin Lee, Woosung Park
doaj +2 more sources
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics [PDF]
Advanced ScienceCurrent research on integrated circuits and power electronics is rapidly advancing toward miniaturization, high power density, and multi‐chip integration, which presents unprecedented challenges to the thermal management performance of packaging ...
Yongjun Huo +11 more
doaj +2 more sources
Research progress of methods to reduce solid-solid contact thermal resistance [PDF]
Journal of Hebei University of Science and Technology, 2023 Reducing solid-solid interface contact thermal resistance is an efficient and widely used method for reducing heat transfer resistance in devices. Increasing the effective contact of the interface according to the solid-solid interface state can enhance ...
Qingsong SONG +3 more
doaj +1 more source
Effect of Post-Deposition Thermal Treatments on Tensile Properties of Cold Sprayed Ti6Al4V
Metals, 2022 This study aims at investigating the effect of various post-deposition thermal treatments on improving tensile properties of cold spray (CS) deposited titanium alloy Ti6Al4V.
Dibakor Boruah +4 more
doaj +1 more source
Research progress of diamond/aluminum composite interface design
Functional Diamond, 2022 Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management.
Zengkai Jiao +9 more
doaj +1 more source