Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction [PDF]
Nano-Micro Letters, 2022 Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides).
Wen Dai +15 more
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Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics [PDF]
Nanomaterials, 2022 With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area.
Wenkui Xing +3 more
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Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance [PDF]
Nanomaterials, 2021 We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends
Sriharsha Sudhindra +2 more
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Graphene-Assisted Thermal Interface Materials with a Satisfied Interface Contact Level Between the Matrix and Fillers [PDF]
Nanoscale Research Letters, 2018 Reduced graphene oxide (RGO) and three-dimensional graphene networks (3DGNs) are adopted to improve the performance of thermal interface materials (TIMs). Therein, the 3DGNs provide a fast transport network for phonons, while the RGO plays as a bridge to
Bo Tang +4 more
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Materials & Design, 2021 With the development of electronic technologies, electronic devices become smaller, while their power density increases dramatically. The resulting excessive heat requires excellent heat dissipation to ensure great performance of the devices.
Xiaoxiao Guo +4 more
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Thermal interface materials [PDF]
Journal of Materials Engineering and Performance, 2001 Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink.
Deborah Chung
exaly +2 more sources
Thermal interface materials: From fundamental research to applications
SusMatThe miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering ...
Baojie Wei +7 more
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Intrinsic Curvature-Induced Regulation of Interfacial Thermal Transport in Janus TMD Heterostructures [PDF]
MoleculesEfficient interfacial thermal transport in two-dimensional heterostructures is essential for improving heat dissipation and operational stability in next-generation energy conversion and energy electronic devices.
Lixia Shi +3 more
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Research progress of methods to reduce solid-solid contact thermal resistance [PDF]
Journal of Hebei University of Science and Technology, 2023 Reducing solid-solid interface contact thermal resistance is an efficient and widely used method for reducing heat transfer resistance in devices. Increasing the effective contact of the interface according to the solid-solid interface state can enhance ...
Qingsong SONG +3 more
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Effect of Post-Deposition Thermal Treatments on Tensile Properties of Cold Sprayed Ti6Al4V
Metals, 2022 This study aims at investigating the effect of various post-deposition thermal treatments on improving tensile properties of cold spray (CS) deposited titanium alloy Ti6Al4V.
Dibakor Boruah +4 more
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