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With the development of electronic technologies, electronic devices become smaller, while their power density increases dramatically. The resulting excessive heat requires excellent heat dissipation to ensure great performance of the devices.
Xiaoxiao Guo +4 more
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Thermal interface materials: From fundamental research to applications
The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering ...
Baojie Wei +7 more
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Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects
We provide a summary of the fundamentals of thermal management, outline the state-of-the-art in the field of thermal interface materials, and describe recent developments in graphene-based non-curing and curing composites used for thermal management. The
Sriharsha Sudhindra +2 more
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Thermal Conductivity Determination of Ga-In Alloys for Thermal Interface Materials Design
Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications.
Parker Maivald, Soumya Sridar, Wei Xiong
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Influence of Interface Thermal Resistance on Relaxation Dynamics of Metal-Dielectric Nanocomposite Materials under Ultrafast Pulse Laser Excitation [PDF]
Nanocomposite materials, including noble metal nanoparticles embedded in a dielectric host medium, are interesting because of their optical properties linked to surface plasmon resonance phenomena.
M. Rashidi Huyeh, N. Moosavinejad
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Brownian Thermal Noise in Multilayer Coated Mirrors [PDF]
We analyze the Brownian thermal noise of a multi-layer dielectric coating, used in high-precision optical measurements including interferometric gravitational-wave detectors.
Eric K. Gustafson +10 more
core +3 more sources
Temperature fields in a channel partially filled with a porous material under local thermal non-equilibrium condition: an exact solution [PDF]
This work examines analytically the forced convection in a channel partially filled with a porous material and subjected to constant wall heat flux. The Darcy–Brinkman–Forchheimer model is used to represent the fluid transport through the porous material.
Karimi, Nader +2 more
core +3 more sources
Thermal conductive materials with reliable and high performances such as thermal interface materials are crucial for rapid heat transferring in thermal management.
Zhe Shi +4 more
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Graphene Thermal Interface Materials [PDF]
Abstract not Available.
openaire +1 more source
Noncuring Graphene Thermal Interface Materials for Advanced Electronics
Development of next‐generation thermal interface materials (TIMs) with high thermal conductivity is important for thermal management and packaging of electronic devices. The synthesis and thermal conductivity measurements of noncuring thermal paste, i.e.,
Sahar Naghibi +7 more
doaj +1 more source

