Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials
We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing epoxy-based thermal interface materials with graphene fillers.
Jacob S. Lewis +4 more
doaj +2 more sources
Research progress of diamond/aluminum composite interface design
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management.
Zengkai Jiao +9 more
doaj +1 more source
Graphene Thermal Interface Materials – State-of-the-Art and Application Prospects
We provide a summary of the fundamentals of thermal management, outline the state-of-the-art in the field of thermal interface materials, and describe recent developments in graphene-based non-curing and curing composites used for thermal management. The
Sriharsha Sudhindra +2 more
doaj +1 more source
Thermal Conductivity Determination of Ga-In Alloys for Thermal Interface Materials Design
Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications.
Parker Maivald, Soumya Sridar, Wei Xiong
doaj +1 more source
Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces [PDF]
Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC(16 ...
G. U. Kulkarni +11 more
core +1 more source
The influence of oxidative-thermal degradation of polypropylene on measured interface strength of glass fibre-polypropylene [PDF]
It was previously found that thermal-oxidative degradation of the polypropylene could significantly affect the measured interfacial strength of glass fibre reinforced polypropylene (GF-PP) micro-composite.
Zhu, W.Z., Yang, Liu, Thomason, J.L.
core +3 more sources
Thermal and rheological properties of microencapsulated phase change materials [PDF]
The use of microencapsulated phase change materials (MPCMs) is one of the most efficient ways of storing thermal energy. When the microencapsulated phase change material (MPCM) is dispersed into the carrier fluid, microencapsulated phase change slurry ...
Zhao, Changying +3 more
core +1 more source
Influence of Interface Thermal Resistance on Relaxation Dynamics of Metal-Dielectric Nanocomposite Materials under Ultrafast Pulse Laser Excitation [PDF]
Nanocomposite materials, including noble metal nanoparticles embedded in a dielectric host medium, are interesting because of their optical properties linked to surface plasmon resonance phenomena.
M. Rashidi Huyeh, N. Moosavinejad
doaj +1 more source
Noncuring Graphene Thermal Interface Materials for Advanced Electronics
Development of next‐generation thermal interface materials (TIMs) with high thermal conductivity is important for thermal management and packaging of electronic devices. The synthesis and thermal conductivity measurements of noncuring thermal paste, i.e.,
Sahar Naghibi +7 more
doaj +1 more source
Thermal conductive materials with reliable and high performances such as thermal interface materials are crucial for rapid heat transferring in thermal management.
Zhe Shi +4 more
doaj +1 more source

