Results 21 to 30 of about 644,566 (284)
Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials
We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing epoxy-based thermal interface materials with graphene fillers.
Jacob S. Lewis +4 more
doaj +1 more source
Thermal interface materials (TIMs) are a critical component of thermal management systems, with efforts being made to improve their thermal conductivity (k) to enhance their thermal-management performance in electronic devices.
Jing Zhou +6 more
doaj +1 more source
The thermal transport properties of porous silicon and nano-hybrid "porous silicon/water" systems are presented here. The thermal conductivity was evaluated with equilibrium molecular dynamics technique for porous systems made of spherical voids or water-
Isaiev, Mykola +3 more
core +3 more sources
High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials
AbstractThermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance.
Lin Jing +9 more
openaire +2 more sources
Thermal boundary resistance from transient nanocalorimetry: a multiscale modeling approach [PDF]
The Thermal Boundary Resistance at the interface between a nanosized Al film and an Al_{2}O_{3} substrate is investigated at an atomistic level. A room temperature value of 1.4 m^{2}K/GW is found.
Banfi, Francesco +7 more
core +2 more sources
Thermal Interface Materials [PDF]
Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink.
openaire +1 more source
Recent Advances in Thermal Interface Materials [PDF]
2.Yongcun Zhou, Siqi Wu,Yuheng Long, Pengli Zhu, Feixiang Wu, Feng Liu,Vignesh Murugadoss, Williams Winchester, Amit Nautiyal, Zhe Wangand Zhanhu Guo,Recent Advances in Thermal Interface Materials,ES Mater. Manuf.., 2020,7, 4-24.DOI: doi.org/10.30919/esmm5f717 In recent years, miniaturization and integration have become the development trends of ...
Yongcun Zhou +10 more
openaire +1 more source
We report results of experimental investigation of temperature rise in concentrated multi-junction photovoltaic solar cells with graphene-enhanced thermal interface materials.
Mohammed Saadah +2 more
doaj +1 more source
Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration
Silicon carbide bonded diamond composites are a class of materials with great potential for a wide range of demanding applications in industry. They can be produced by pressureless infiltration of diamond preforms with liquid silicon.
B. Matthey +3 more
doaj +1 more source
Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances [PDF]
As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important.
Yegin Cengiz +14 more
openaire +5 more sources

