RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances
Nanoscale Research Letters, 2017 With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization.
Tang Bo +6 more
doaj +1 more source
Molecules, 2021 Front tracking and enthalpy methods used to study phase change processes are based on a local thermal energy balance at the liquid–solid interface where mass accommodation methods are also used to account for the density change during the phase ...
Suset Rodríguez-Alemán +3 more
doaj +1 more source
A symplectic analytical singular element for steady-state thermal conduction with singularities in composite structures [PDF]
, 2016 In modern design of composite structures, multiple materials with different properties are bound together. Accurate prediction of the strength of the interface between different materials, especially with the existence of cracks under thermal loading, is
Gao, H. Y. +3 more
core +1 more source
Investigating the Thermal Conductance of the Cu/Si Interface Using the Molecular Dynamics Method
MetalsInvestigating thermal transport at the Cu/Si interface holds significant importance, as understanding interface thermal conductance is crucial for enhancing materials interface thermal management, designing thermal interface materials, and improving the ...
Shuai Liu +6 more
doaj +1 more source
Wave reflection at a free interface in an anisotropic pyroelectric medium with nonclassical thermoelasticity [PDF]
, 2016 In this paper, the well-established two-dimensional mathematical model for linear pyroelectric materials is employed to investigate the reflection of waves at the boundary between a vacuum and an elastic, transversely isotropic, pyroelectric material.
A. E. N. Abd alla +4 more
core +1 more source
Reduction of Device Operating Temperatures with Graphene-Filled Thermal Interface Materials
C, 2021 The majority of research into few layer graphene (FLG) thermal interface materials (TIM) concerns the direct quantification of innate composite properties with much less direct analysis of these materials in realistic applications.
Jacob S. Lewis
doaj +1 more source
InGaAs/InP double heterostructures on InP/Si templates fabricated by wafer bonding and hydrogen-induced exfoliation [PDF]
, 2003 Hydrogen-induced exfoliation combined with wafer bonding has been used to transfer ~600-nm-thick films of (100) InP to Si substrates. Cross-section transmission electron microscopy (TEM) shows a transferred crystalline InP layer with no observable ...
Ahrenkiel, S. P. +4 more
core +1 more source
, 2014 Detailed understanding of vibrational heat transfer mechanisms between solids is essential for the efficient thermal engineering and control of nanomaterials.
Oksanen, J. +3 more
core +3 more sources
Thermal time constant : improving the accuracy of skin temperature predictive modelling in lower limb prostheses [PDF]
, 2015 Elevated skin temperature at the body/device interface of lower-limb prostheses is one of the major factors that affect tissue health [1]. The heat dissipation in prosthetic sockets is greatly influenced by the thermal conductive properties of the hard ...
Buis, Arjan, Glesk, Ivan, Mathur, Neha
core +1 more source
Calpain small subunit homodimerization is robust and calcium‐independent
FEBS Letters, EarlyView.Calpains dimerize via penta‐EF‐hand (PEF) domains. Using single‐molecule force spectroscopy, we measured the strength and kinetics of PEF–PEF homodimer binding. The interaction is robust, shows a transient conformational step before dissociation, and remains largely insensitive to Ca2+.
Nesha May O. Andoy +4 more
wiley +1 more source