Results 281 to 290 of about 260,308 (356)

Characteristics of Polybenzoxazine Aerogels as Thermal Insulation and Flame-Retardant Materials. [PDF]

Gels
Asrafali SP, Periyasamy T, Lee J.
europepmc   +1 more source

Simulation analysis of insulation materials in high-temperature environment based on comsol thermal design

Qiushi Liu, Zhenyuan Xu, Xiaodong Chen, Shihua Li   +3 more
openalex   +1 more source

Dual‐Interface‐Dominant Cathode Architectures Enabling Fast Sulfur Redox and Stable Interfaces in All‐Solid‐State Li‐S Batteries

Advanced Functional Materials, EarlyView.
An optimized carbon host nanostructure enables a dual‐interface‐dominant architecture in sulfur cathodes of solid‐state Li‐S batteries by selectively forming sulfur|carbon and sulfur|solid electrolyte interfaces. This tailored interfacial configuration accelerates sulfur redox kinetics by establishing enriched Li+/e– transport networks, while ...
Zhao Yang, Yuxiao Zhang, Yihong Liu, Geng Xie, Yu Dou, Jeremy Dawkins, Lijia Liu, Yixiang Wang, Lingzi Sang, Mohsen Shakouri, Sixu Deng, Karim Zaghib, Tsun‐Kong Sham, Xia Li   +13 more
wiley   +1 more source

Application of a Gyroid Structure for Thermal Insulation in Building Construction. [PDF]

Materials (Basel)
Anwajler B, Szołomicki J, Noszczyk P.
europepmc   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source

Transparent Wood Fiber-Reinforced Epoxy-Resin Electromagnetic-Shielding Materials with Superior Mechanical Strength and Thermal Insulation Performance. [PDF]

Materials (Basel)
Gao J, Wu Z, Zhu L, Gao Y, Cai L, Zhu Z, Zhang Y.   +6 more
europepmc   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

Advanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

Thermal Insulation Foam of Polystyrene/Expanded Graphite Composite with Reduced Radiation and Conduction. [PDF]

Polymers (Basel)
Gong P, Tran MP, Buahom P, Detrembleur C, Thomassin JM, Kenig S, Wang Q, Park CB.   +7 more
europepmc   +1 more source

Electric Field‐Dependent Conductivity as Probe for Charge Carrier Delocalization and Morphology in Organic Semiconductors

Advanced Functional Materials, EarlyView.
Applying a high electric field to a doped organic semiconductor heats up the charge carrier distribution beyond the lattice temperature, enhancing conductivity. It is shown that the associated effective temperature can be used to extract the effective localization length, which is a characteristic length scale of charge transport and provides ...
Morteza Shokrani, Felix Maximilian Graf, Anton Kompatscher, Dennis Derewjanko, Martijn Kemerink   +4 more
wiley   +1 more source