Results 81 to 90 of about 8,274,419 (297)

Suppression of electromigration failure in Ni added Sn-30Bi solder composite as thermal interface material

Journal of Alloys and Metallurgical Systems
This research work investigates the effect of nickel addition (Ni) on electromigration failure resistance of lead-free solder alloy Sn–30Bi as a thermal interface material.
Munim Shahriar Jawad, Md. Mahmudul Islam, Sadia Rafiq, Md. Muktadir Billah   +3 more
doaj   +1 more source

Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements

Energies, 2019
Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in
Gabor Farkas, Zoltan Sarkany, Marta Rencz   +2 more
doaj   +1 more source

The thermal contact resistance of a steel-ceramic interface with oxide intermediates

Cogent Engineering, 2020
Metal structures covered by refractories are widely employed in high temperature processes such as incineration and metal production. The thermal resistance in refractories used in high temperature processes is associated with different phases, phase ...
Jussi Silvonen, Erkki Levänen, Mikko Uusitalo   +2 more
doaj   +1 more source

Workflow for Design of Experiments‐Based Modeling of Species Transport and Growth Kinetics in GaN Hydride Vapor Phase Epitaxy

Advanced Engineering Materials, EarlyView.
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič, G. Lukin, H. Torkashvand, A. Kerschbaum, M. Müller, S. Besendörfer, J. Heitmann, J. Friedrich   +7 more
wiley   +1 more source

Fabrication and Characterisation of Carbon Nanotube Array Thermal Interface Materials [Elektronisk resurs]

, 2018
The performance of electronic devices has long been limited by thermal dissipation which will result in device failure if not handled properly.
NYLANDER, ANDREAS,
core  

Ontology‐Aligned Structuring and Reuse of Multimodal Materials Data and Workflows Toward Automatic Reproduction

Advanced Engineering Materials, EarlyView.
Reproduction of stacking fault energy calculations from literature with a semi‐automated large language model‐assisted extraction procedure: extraction of simulation protocol, atomistic structures, computational parameters, and reported results, ontology alignment, knowledge graph construction and, finally, recomputation forvalidation.
Sepideh Baghaee Ravari, Abril Azocar Guzman, Sarath Menon, Stefan Sandfeld, Tilmann Hickel, Markus Stricker   +5 more
wiley   +1 more source

Melting and solidification models and thermal characteristics of microencapsulated phase change materials [PDF]

Microencapsulated phase change material (MPCM) as a new thermal energy storage material and a heat transfer medium have attracted considerable attention in the thermal energy storage field.
Yang, Jia (Researcher in engineering)
core  

Electrochemical Behavior of Flame‐Sprayed Sc‐Doped AlCoCrFeMo High‐Entropy Alloy Coatings in 3.5% Sodium Chloride Solution

Advanced Engineering Materials, EarlyView.
Scandium (Sc)‐doped AlCoCrFeMo HEA coatings are fabricated via flame spraying with 0.1, 0.3, and 0.5 wt% Sc additions. Among these, the HEA‐Sc0.3 coating exhibits the highest corrosion resistance, indicated by a more positive corrosion potential and lower current density.
Pankaj Kumar, Akash Vyas, Mohammad Aatif Qazi, Nashit Jalal, Maria Ophelia Jarligo, Mostafa Yakout, Jing Liu, André McDonald   +7 more
wiley   +1 more source

Comparison of Triply Periodic Minimal Surface Energy Absorbers Under Uniaxial Compressive Loading

Advanced Engineering Materials, EarlyView.
This study investigates LCD 3D printed Triply Periodic Minimal Surface (TPMS) structures as mechanical energy absorbers. By comparing various base designs and layered combinations under uniaxial compression, it identifies that a Diamond‐Gyroid sandwich structure offers superior performance.
Sergej Grednev, Noah‐Lean Roschlaub, Anne Jung   +2 more
wiley   +1 more source

Thermomechanical Behavior and Experimental Study of Additive Manufactured Superalloy/Titanium Alloy Horizontal Multi-Material Structures

Metals
In laser powder bed fusion (LPBF) forming multi-material structures, the thermal stress mismatch caused by the different thermophysical properties of different materials can cause interface cracking and delamination defects.
Yanlu Huang, Tianyu Wang, Linqing Liu, Yang Li, Changjun Han, Hua Tan, Wei Zhou, Yongqiang Yang, Di Wang   +8 more
doaj   +1 more source