Results 81 to 90 of about 7,625,249 (285)
Reproduction of stacking fault energy calculations from literature with a semi‐automated large language model‐assisted extraction procedure: extraction of simulation protocol, atomistic structures, computational parameters, and reported results, ontology alignment, knowledge graph construction and, finally, recomputation forvalidation.
Sepideh Baghaee Ravari +5 more
wiley +1 more source
Increasing power densities in high-power electronic packages require advanced heat transmission from their respective thermal interface materials (TIMs).
Qiuhong Zhang +5 more
doaj +1 more source
Scandium (Sc)‐doped AlCoCrFeMo HEA coatings are fabricated via flame spraying with 0.1, 0.3, and 0.5 wt% Sc additions. Among these, the HEA‐Sc0.3 coating exhibits the highest corrosion resistance, indicated by a more positive corrosion potential and lower current density.
Pankaj Kumar +7 more
wiley +1 more source
Summary: Macroscopic conductive solid-state thermal diodes, composed of two dissimilar materials, are approaching limits in rectification performance and operating range. Beyond material choice, alternative design strategies have been explored.
Katja Vozel, Andrej Kitanovski
doaj +1 more source
Comparison of Triply Periodic Minimal Surface Energy Absorbers Under Uniaxial Compressive Loading
This study investigates LCD 3D printed Triply Periodic Minimal Surface (TPMS) structures as mechanical energy absorbers. By comparing various base designs and layered combinations under uniaxial compression, it identifies that a Diamond‐Gyroid sandwich structure offers superior performance.
Sergej Grednev +2 more
wiley +1 more source
Experiments and thermophysical simulations were conducted to investigate the electron beam powder bed fusion electron beam (PBF‐EB/M) process for the γ′‐strengthened nickel‐based superalloy Inconel 738LC. The results demonstrate the impact of process‐induced microstructural variations on high‐temperature mechanical behavior, providing a basis for ...
Jan Niklas Petenati +11 more
wiley +1 more source
Characterization of thermal interface materials for thermal simulation
Paper 12Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimisation of the system design with the help of simulation methods.
May, D. +6 more
core +1 more source
Thermal interface materials are the important development direction for solving heat transfer in microelectronics industry. Moreover, synergic effect is an important means to improve thermal conductivity of thermal interface materials.
Changqing Liu +4 more
doaj +1 more source
In situ synchrotron high‐energy X‐ray diffraction reveals the real‐time high‐temperature phase evolution of a ternary V‐9Si‐6.5B alloy. The study uncovers a kinetically delayed V5SiB2 → V8SiB4 transformation governed by massive structural and chemical barriers.
Zahra Sabeti +4 more
wiley +1 more source
Architecture and materials selection in multi-materials design [PDF]
The design process involving both the architecture and the materials represents an hard task mainly due to the high number of potential configurations, thus requiring firstly the development of new and more rigorous approaches but also the development of
BARACCHINI, Paul +6 more
core

