Results 101 to 110 of about 644,566 (284)

Optimum interface properties for metal matrix composites [PDF]

Due to the thermal expansion coefficient mismatch (CTE) between the fiber and the matrix, high residual sresses exist in metal matrix composite systems upon cool down from processing temperature to room temperature.
Ghosn, Louis J., Lerch, Bradley A.
core   +1 more source

Determination of Stress Intensity Factor for Interface Crack under Uniform Heat Flow by Crack Tip Stress Method [PDF]

, 2012
This paper deals with the analysis of the thermal stress intensity factor for interfacial crack in dissimilar materials under uniform heat flow by using the finite element method.
Aoki Ryuta, Noda Nao-Aki, Oda Kazuhiro   +2 more
core   +1 more source

Investigation of Thermo‐Chemical Processes in Commercial MgO‐C Refractory Bricks With and Without MgO‐C Recyclate at Elevated Temperatures

Advanced Engineering Materials, EarlyView.
This study investigates thermo‐chemical processes during high‐temperature testing of two commercial MgO‐C brick grades, one containing 47.5 wt.% MgO‐C recyclate. Using ETV, DTA/TG‐MS, XRD, and SEM/EDS/EBSD, mechanisms such as carbothermal reduction of magnesia, impurity incorporation into the secondary MgO surface layer, and calcium‐rich phase ...
Alexander Schramm, Jana Hubálková, Christian Schimpf, Thomas Schemmel, Christos G. Aneziris, Anja Weidner, Horst Biermann   +6 more
wiley   +1 more source

Progress in Research on Bonding Interface Between Thermal Spraying Coating and Substrate

Cailiao gongcheng, 2017
In the process of thermal spraying remanufacturing,a heterogenerous bonding interface always exists between the coating and matrix due to the materials reason.And the formation and existence of the bonding interface has a significant influence on the ...
LIU Jian, MENG Fan-jun, YIN Feng-liang, CHEN Yong-xiong, LIANG Xiu-bing   +4 more
doaj   +1 more source

Combined Process‐ and Phase‐Field‐Simulation to Predict the Microstructure of Single‐Crystal Ni‐Based Superalloys

Advanced Engineering Materials, EarlyView.
A combined finite element and phase‐field approach predicts the evolution of microstructure during the directional solidification of Ni‐based superalloys. The model reveals how withdrawal rate, temperature gradient, and wall thickness control the dendrite spacing, highlighting the strong effect of surface regions in thin sections where dendrite growth ...
Sean Böhm, André B. Baldissera, Rainer Völkl, Uwe Glatzel   +3 more
wiley   +1 more source

Preparation of Monotrimethoxylsilylethyl-Terminated Polysiloxane Fluids and Their Application in Thermal Interface Materials. [PDF]

Polymers (Basel), 2023
Liu Y, Long X, Wang Y, Wu C, Qu Z, Pei Z, Shi C, Wang T, Dong H.   +8 more
europepmc   +1 more source

Thermophysical Properties of the Desulphurization Slags With Various CaS and CaO/Al2O3 Ratio

Advanced Engineering Materials, EarlyView.
This article investigates how CaS content and the CaO/Al2O3 ratio influence the thermophysical properties of desulphurization slags. Using experimental measurements and thermodynamic simulations, this study reveals complex effects on viscosity, surface tension, and density, providing new insight into slag structure and phase behavior under ...
Eldar Salpagarov, Matheus Roberto Bellé, Anton Yehorov, Julia Richter, Olena Volkova   +4 more
wiley   +1 more source

Research progress on preparation methods, interface modification, and first-principles calculation of diamond/copper composites

Fenmo yejin jishu
Diamond/copper composites have the excellent thermal conductivity and the controllable thermal expansion coefficient, making them expected to become new generation of thermal management materials.
WANG Bangqiang, LI Bin, GUO Shengda, WU Shigui, YANG Bo, ZHANG Jianbo, YE Ying   +6 more
doaj   +1 more source

Hot-Pressed Super-Elastic Graphene Aerogel with Bidirectional Thermal Conduction Properties as Thermal Interface Materials. [PDF]

Materials (Basel), 2023
Lv P, Zhou X, Chen S.
europepmc   +1 more source

A compliant microstructured thermal interface material for dry and pluggable interfaces

International Journal of Heat and Mass Transfer, 2019
Abstract Thermal interface materials (TIMs), such as thermal pastes and pads, can successfully enhance contact thermal conductance by filling the gaps caused by the surface nonflatness and roughness. However, there is still an unaddressed demand for TIMs which can be applied to pluggable or reworkable interfaces in electronic systems, such as in opto-
Cui, J., Wang, J., Weibel, J. A., Pan, L.   +3 more
openaire   +4 more sources