Results 121 to 130 of about 7,625,249 (285)
The external influencing factors, the thermal interface material, load-bearing brick weight, and temperature difference, of a thermoelectric generator (TEG) device were experimentally examined.
Chengyu Gu +9 more
doaj +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source
Temperature rise in multi-junction solar cells reduces their efficiency and shortens their lifetime. We report the results of the feasibility study of passive thermal management of concentrated multi-junction solar cells with the non-curing graphene ...
Barath Kanna Mahadevan +3 more
core +1 more source
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan +4 more
wiley +1 more source
Characterization of Thermal Interface Materials to Support Thermal Simulation
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data. For the
Schacht, R. +6 more
openaire +2 more sources
Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation. [PDF]
Nylander A +5 more
europepmc +1 more source
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley +1 more source
The performance of electronic devices has long been limited by thermal dissipation which will result in device failure if not handled properly.
NYLANDER, ANDREAS,
core
Progress and Prospective of Thermal Interface Materials for Thermal Management
ABSTRACT Thermal management plays a crucial role in the safe operation of high‐power‐density electronics. High‐performance thermal interface materials (TIMs) are becoming an urgent demand to assure effective energy transfer from heat sources to heat sinks.
Zhengchuang Zhao, Siqi Wang, Tingxian Li
openaire +1 more source
Surface Modification Using Polydopamine-Coated Liquid Metal Nanocapsules for Improving Performance of Graphene Paper-Based Thermal Interface Materials. [PDF]
Gao J +14 more
europepmc +1 more source

