Results 111 to 120 of about 7,625,249 (285)

High-Performance Thermal Interface Materials with Magnetic Aligned Carbon Fibers. [PDF]

Materials (Basel), 2022
Wu Q, Miao J, Li W, Yang Q, Huang Y, Fu Z, Yang L.   +6 more
europepmc   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling

Nature Communications
Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal ...
Rui Cheng, Qixian Wang, Zexiao Wang, Lin Jing, Ana V. Garcia-Caraveo, Zhuo Li, Yibai Zhong, Xiu Liu, Xiao Luo, Tianyi Huang, Hyeong Seok Yun, Hakan Salihoglu, Loren Russell, Navid Kazem, Tianyi Chen, Sheng Shen   +15 more
doaj   +1 more source

Chloroform-Assisted Rapid Growth of Vertical Graphene Array and Its Application in Thermal Interface Materials. [PDF]

Adv Sci (Weinh), 2022
Xu S, Cheng T, Yan Q, Shen C, Yu Y, Lin CT, Ding F, Zhang J.   +7 more
europepmc   +1 more source

Influence of TiC and TiN Ceramic Reinforcements on the Microstructure, Thermal Expansion Behavior, and Tensile Properties of Invar 36 Manufactured by Laser Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji, Natasha Sacks, Johannes Pötschke, Björn Matthey   +3 more
wiley   +1 more source

Printable Boron Nitride–Liquid Metal Hybrid Thermal Interface Materials for Advanced Electronics

Efficient thermal management and mechanical flexibility are crucial for modern electronic devices, where compact designs and high power densities generate substantial heat, demanding materials with both high efficiency and excellent conformability ...
Hu, Tan, Li, Yun, Huang, Peiwen, Bark, Hyunwoo, Lee, Pooi See, Jiang, Yixuan   +5 more
core   +1 more source

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

, 2014
In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation
Ye, L., Y. Fu, Sun, Shuangxi,, Ziaei, A.,, Fu, Yifeng,, A. Ziaei, Ziaei, A., Daon, J., Leveugle, E.M.,, Liu, Johan,, Sun, Shuangxi, Cibien, G.,, Cibien, G., J. Daon, Liu, Johan, Bai, J.,, Daon, J.,, Leveugle, E.M., Galindo, C., Jiang, Di, Fu, Y., C. Galindo, J. Liu, Galindo, C.,, Fu, Yifeng, D. Jiang, G. Cibien, L. Ye, J. Bai, Jiang, Di,, Ye, L.,, S. Sun, E. Leveugle, Bai, J.   +33 more
core   +1 more source

A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics

Journal of Materials Research and Technology
The development of novel thermal management materials (TIMs) is crucial for advancing GaN/SiC-driven high-power electronics, laser diodes, and RF electronics.
Abdul Wahid Shah, Kang Wang, Jabir Ali Siddique, Wenfang Li   +3 more
doaj   +1 more source

Crosslinking effect of borax additive on the thermal properties of polymer-based 1D and 2D nanocomposites used as thermal interface materials. [PDF]

Sci Rep, 2022
Chen G, Yadav AA, Jung IW, Lee J, Choi K, Kang SW.   +5 more
europepmc   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

Advanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source