Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction. [PDF]
Dai W +15 more
europepmc +1 more source
Elastic Properties and Thermal Expansion Behavior of a Polycrystalline VMnFeCoNi High‐Entropy Alloy
The high‐entropy alloy (HEA) V20Mn20Fe20Co20Ni20 (composition in at.%) can be made single‐phase face‐centered cubic (FCC) when annealed above 1338 K followed by water quenching. In this state, the alloy exhibits the greatest strength‐ductility combination of any quinary single‐phase FCC HEA.
Guillaume Laplanche +3 more
wiley +1 more source
Interface Thermal Resistance in Heterostructures of Micro-Nano Power Devices: Current Status and Future Challenges. [PDF]
Shen Y +5 more
europepmc +1 more source
A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance. [PDF]
Wang Z +6 more
europepmc +1 more source
Multilayer Self‐Limiting Electrospray Deposition via Stepped Voltage Bias
Self‐limiting electrospray deposition (SLED) uses a high voltage to generate and deposit a charged payload on a target surface. The coating retains its charge, repelling newly arriving material. SLED thickness can be decreased by applying a secondary bias to the target.
Madhuri Deb +3 more
wiley +1 more source
Solution-sheared supramolecular oligomers with enhanced thermal resistance in interfacial adhesion and bulk cohesion. [PDF]
Lu G +8 more
europepmc +1 more source
Airport Cement Concrete with Ceramic Dust of Increased Thermal Resistance. [PDF]
Linek M.
europepmc +1 more source
Residual adhesive after electrode loading in adhesive‐assisted resistance spot welding is quantified through a traceable experimental‐to‐digital workflow. Chromatic confocal topography provides calibrated surface‐height data, while OpenCV detects the electrode imprint and integrates adhesive height into comparable volume metrics.
Sung‐Min Wi, Jiangdong Zhao
wiley +1 more source
Predicting Thermal Resistance of Packaging Design by Machine Learning Models. [PDF]
Lai JP +5 more
europepmc +1 more source
A Comprehensive Review of Variability in the Thermal Resistance (D-Values) of Food-Borne Pathogens-A Challenge for Thermal Validation Trials. [PDF]
Soni A, Bremer P, Brightwell G.
europepmc +1 more source

