Results 151 to 160 of about 4,567,939 (306)
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan +4 more
wiley +1 more source
Effects of Mg on Microstructure and Solidification of a Hypereutectic Zn–8 wt.%Al Alloy
An appreciable set of results involving thermal data, microstructure, chemical composition, and microstructural growth laws is reported for ZnAlMg alloys. Such results demonstrate that ZnAlMg alloys have high potential for applications in automotive self‐lubricating components, batteries, and electrical systems.
Raí B. de Sousa +6 more
wiley +1 more source
Thermal Shock Resistance of Porous Al2O3-Mullite Ceramics
In this study, the effects of two types of SiO2 sources (amorphous micro-sized SiO2 particles and in situ oxidised SiC nanopowder) on the thermal shock resistance of porous Al2O3 mullite ceramics were compared.
Zaķe-Tiļuga, Ieva +3 more
core
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul +5 more
wiley +1 more source
External Thermal Insulation Composite Systems (ETICSs) are increasingly applied in both new construction and energy retrofitting, where long-term durability under environmental exposure is critical to preserving thermal efficiency.
Giovanni Borsoi +15 more
core +1 more source
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe +6 more
wiley +1 more source
The reliability of thermal interface materials (TIM1) in lidded high-power flip-chip packages is investigated using a thermal test vehicle (TTV) under active power cycling.
Sternberg, Maik +5 more
core +1 more source
Despite benefits to storage stability and handleability of aluminum scrap, octadecyl phosphonic acid (ODPA) SAMs reduce the tensile strength of wires produced using friction‐induced recycling. Etching and methyl diphosphonic acid (MDPA) coatings, however, have little effect.
Timothy D. Goller +3 more
wiley +1 more source
Rotary 3D Printing With Integrated Electroplating
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria +5 more
wiley +1 more source
A high interstital austenitic steel is additively manufactured and postdensified by HIP to eliminate gas porosity. Thereby, the loss of N and Mn in Ar HIP atmosphere is investigated. Further, HIP using N2 atmosphere is investigated which led to excessive nitride formation.
F. Großwendt +4 more
wiley +1 more source

