In-plane thermal transport and interfacial thermal resistance in carbon/silicon carbide van der Waals heteronanotubes: a molecular dynamics study. [PDF]
Dhrubo DS, Islam ASMJ, Mia I.
europepmc +1 more source
Macroscopic negative differential thermal resistance in the overlapping graphene homojunction structure. [PDF]
Wu R +6 more
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Microstructural evolution of premium rail steel during flash butt welding (FBW), comparing physically simulated heat‐affected zones with actual weld regions. Thermal cycles induce phase transformations and microstructural heterogeneity that influence weld quality and mechanical performance. These findings provide insights into optimizing FBW parameters
Emmanoelle Cintra da Cunha Araújo +15 more
wiley +1 more source
Optimization of Processing Parameters and Application Performance Evaluation of a High Thermal Conductivity, Low Thermal Resistance Gel. [PDF]
Xu Y +7 more
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Validation of a Skin Calorimeter to Determine the Heat Capacity and the Thermal Resistance of the Skin. [PDF]
Rodríguez de Rivera PJ +3 more
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Accelerated in situ formation of TiB and TiC in Ti–5Al–2.5Sn–B4C is driven by transient liquid phase formation, which enhances particle reactions and microstructural evolution. This process increases hardness and establishes a coupled relationship between sintering temperature and reinforcement content, strongly influencing porosity in the resulting ...
Fernando. Y. Kojima, Juliano. Soyama
wiley +1 more source
Strategy Construction to Improve the Thermal Resistance of Polyimide-Matrix Composites Based on Fiber-Resin Compatibility. [PDF]
Xing Y, Ni H, Zhang D, Li J, Chen X.
europepmc +1 more source
Comparative Transcriptome Analyses Provide New Insights into the Evolution of Divergent Thermal Resistance in Two Eel Gobies. [PDF]
Liu J +7 more
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Particle morphology controls the balance between printability and electrical connectivity in low‐temperature AgCu/Ag metallization pastes. Flake‐shaped AgCu particles form extended low‐resistance contacts, whereas spherical particles favor processability at high metal loading. Fine Ag particles further tune void filling and conductive‐network formation
O. Mhirsi +3 more
wiley +1 more source
A thermal resistance prediction model for heterogeneous integrated chips incorporating an AI-based BP neural network. [PDF]
Li Y, Xu S, Guo L.
europepmc +1 more source

