Results 101 to 110 of about 41,421 (286)
Direct Ink Writing 3D Printing of Recyclable and Thermally Stable Vitrimers
Advanced Materials Technologies, EarlyView.Vitrimers hold great promise in additive manufacturing as defect‐insensitive, repairable, and recyclable feedstocks. A thin‐film additively manufactured process is developed for a high‐performance vitrimer that is difficult to process traditionally.
Louis O. Vaught +2 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.Additive manufacturing revolutionizes production by enabling on‐demand, customized, and sustainable manufacturing with streamlined supply chains. While metal and polymer AM are well‐established, advanced ceramic AM is rapidly emerging, overcoming traditional material challenges.
Kateryna Oleksandrivna Shvydyuk +2 more
wiley +1 more source
Materials Properties of Modifeied Ni-Based Alloy [PDF]
Metalurgija, 2007 The thermomechanical processing of NiMoCr solid solution nickel base superalloy is the way to considerably influence the grain size. As uniform coarse grain size increases the creep strength and crack growth resistance.
Kraus, L. +3 more
doaj
Characterization and analysis of hot compression behaviors of an ultralight Mg-Li-Al alloy
International Journal of Lightweight Materials and Manufacture, 2019 This paper aims at establishing microstructure/property/processing correlations in a thermomechanically processed ultralight Mg-3.5Li-1Al (wt%) alloy. The thermomechanical cycle consists of uniaxial compression at temperatures of 250 °C, 350 °C, and 450 °
Rezawana Islam +3 more
doaj +1 more source
Non-linear model-predictive-control for thermomechanical ring rolling [PDF]
, 2019 he authors present a new ring rolling variant that combines a semi-warm forming process of a bearing ring with controlled cooling directly followed by a cold forming process.
Brosius, Alexander +2 more
core
Aluminum nitride as a new material for chip-scale optomechanics and nonlinear optics
, 2012 Silicon photonics has offered a versatile platform for the recent development of integrated optomechanical circuits. However, silicon is limited to wavelengths above 1100 nm and does not allow device operation in the visible spectrum range where low ...
Fong, King Y. +5 more
core +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Optimizing Thermomechanical Processing of Bimetallic Laminates. [PDF]
Materials (Basel), 2023 Kocich R.
europepmc +1 more source