Results 211 to 220 of about 63,633 (267)

Fluid-structure interaction of thin flexible bodies in multi-material multi-phase systems

Journal of Computational Physics, 2021
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Mehdi Vahab, Mark Sussman, Kourosh Shoele   +2 more
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Germanium Doping, Contacts, and Thin-Body Structures

ECS Meeting Abstracts, 2012
Abstract not Available.
Ray Duffy, Maryam Shayesteh
openaire   +1 more source

On a new phase with body-centered structure in YBa2Cu3O7 thin films

Physica C: Superconductivity, 1990
Abstract A new phase was observed by means of transmission electron microscopy in sputtered hetero-epitaxial films with a sequence of layers of nominal composition YBa 2 Cu 3 O 7 /PrBa 2 Cu 3 O 7 /YBa 2 Cu 3 O 7 . By three-dimensional reconstruction of the reciprocal lattice the crystal structure of the new phase was identified as body-centered.
C.L. Jia, B. Kabius, H. Soltner, U. Poppe, K. Urban   +4 more
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Electromagnetic Wave Scattering on the Structure Consisting of a Magnetodielectric Body and Thin Conductors

Russian Physics Journal, 2020
The method of auxiliary sources is used to solve the problem of electromagnetic wave scattering on the structure consisting of a magnetodielectric body and several thin conductors with finite lengths located close to it. The paper presents the results of numerical computations characterizing the effect of one or two thin conductors on the scattering ...
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Many-body structure of quantum vortices in thin 4He films

Physics Letters A, 1995
Abstract We propose a microscopic theory of quantum vortices in two-dimensional 4 He, applicable to thin superfluid 4 He films. The theory describes the vortex core and reproduces the classical logarithmic behavior at large distances. The single vortex is treated as a quasiparticle.
M. Saarela, F.V. Kusmartsev
openaire   +1 more source

Advanced germanium layer transfer for ultra thin body on insulator structure

Applied Physics Letters, 2016
We present the HEtero-Layer Lift-Off (HELLO) technique to obtain ultra thin body (UTB) Ge on insulator (GeOI) substrates. The transferred ultra thin Ge layers are characterized by the Raman spectroscopy measurements down to the thickness of ∼1 nm, observing a strong Raman intensity enhancement for high quality GeOI structure in ultra thin regime due to
Tatsuro Maeda, Wen-Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Vladimir Poborchii, Yuuichi Kurashima, Hideki Takagi, Noriyuki Uchida   +8 more
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The latent structure of dietary restraint, body dissatisfaction, and drive for thinness: A series of taxometric analyses.

Psychological Assessment, 2010
Although the latent structure of various eating disorders has been explored in previous studies, no published studies have examined the latent structure of theoretically relevant variables that have been shown to cut across eating disorder diagnoses.
Jill M, Holm-Denoma, J Anthony, Richey, Thomas E, Joiner   +2 more
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Multi-threshold voltages in ultra thin-body devices by asymmetric dual-gate structure

Japanese Journal of Applied Physics, 2015
Abstract Control of threshold voltage (V T) by asymmetric dual-gate structure is investigated. Two separated gates are successfully fabricated through two-step chemical mechanical polishing (CMP) processes. Silicon fin width is determined as same as the thickness of oxide sidewall spacer.
H. Kim, J. Park, M. W. Kwon, S. Hwang, B. G. Park   +4 more
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High performance ultra-thin body (2.4nm) poly-Si junctionless thin film transistors with a trench structure

2014 IEEE International Electron Devices Meeting, 2014
The novel trench junctionless poly-Si thin-film transistor (trench JL-TFT) with ultra-thin body (2.4 nm) is utilized to simple dry etching process. This novel devices show excellent performance in terms of steep SS (99 mV/dec.) and high I ON /I OFF (>107). The I ON current of the ultra-thin body (UTB) JL-TFT is increased by quantum confined effect.
Mu-Shih Yeh, Yung-Chun Wu, Min-Hsin Wu, Yi-Ruei Jhan, Ming-Hsien Chung, Min-Feng Hung   +5 more
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A Study on Development of Body Structure Using Hydroforming of a Thin-Walled UHSS Tube

SAE Technical Paper Series, 2013
<div class="section abstract"><div class="htmlview paragraph">Hydroforming process is an emerging manufacturing technology which allows engineers to use continuous closed section without flange for spot weld in a given package envelope.
Munsoo Cha, Cheol-Ung Kim
openaire   +1 more source