Results 91 to 100 of about 9,375,541 (161)

TSV-aware topology generation for 3D Clock Tree Synthesis

, 2013
Clock Tree Synthesis (CTS) mainly consists of two steps: 1) clock tree topology generation and 2) buffering and embedding. Due to the lack of the efficient model of TSVs, most previous CTS of 3D ICs ignore the effect of TSV planning in the first step. In
Yuchun Ma, Huazhong Yang, Wang, Yu, Quan, Jinguo, Xie, Yuan, Wulong Liu, Huazhong Yang, Yang, Haixiao Du, Du, Haixiao, Jinguo Quan, Yuan Xie, Liu, Wulong, Yu Wang, Ma, Yuchun   +13 more
core   +1 more source

Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs

Three-dimensional Integrated Circuits (3D-ICs) vertically stack multiple silicon dies to reduce overall wire length, power consumption, and allow integration of heterogeneous technologies.
Khursheed, Saqib, Zhao, Yi, Al-Hashimi, Bashir   +2 more
core   +1 more source

Comparison of TSV-specific proliferation and cytokine responses among TSV ⁺ MCV ⁺ and TSV^– MCV^– groups.

, 2012
Comparison of TSV-specific proliferation and cytokine responses among TSV + MCV + and TSV– MCV– groups.
Arun Kumar (49927), Rauli Franssila (133517), Tingting Chen (111216), Mohammadreza Sadeghi (133514), Anu Kantele (133499), Tommi Järvinen (133504), Heli Kavola (133510), Klaus Hedman (4783)   +7 more
core   +1 more source

中华鳖病毒(TSV)对鱼类细胞的感染试验

, 2000
将 12种鱼类培养细胞用于中华鳖病毒 ( Trionyx sinesisvirus,TSV)的体外感染试验。结果显示 ,TSV能使鲤鱼上皮乳状瘤细胞 ( EPC)、鳗鲡性腺细胞 ( EG)和草鱼卵巢细胞 ( CO)产生病变。比较了不同培养温度对 TSV感染鱼类细胞的影响以及 TSV引起鱼类细胞病变的特征。 TSV引起 3种鱼类细胞病变 ,经显微观察 ,它们具有不同的病变特征。 TSV感染细胞后 ,其 TCID5 0 在 2 0～ 30℃范围内 ,随温度的升高而增加。超微观察表明 ...
张奇亚,李正秋
core  

Modified W-type configuration for a single-phase reduced parts count 81-level inverter. [PDF]

PLoS One, 2022
Ahmed S, Saqib MA, Kashif SAR.
europepmc   +1 more source

A new seven level boost-type ANPC inverter topology for photovoltaic applications. [PDF]

Sci Rep, 2021
M JS, Almakhles DJ.
europepmc   +1 more source

Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors

International audienceWe developed 1x6μm copper TSV with improved performances in terms of electrical resistance and isolation compared to our formerly published 1x10 μm HD TSV.
Valentin, Paul, Nicolas, Stéphane, Marchand, Jérémy, Suarez-Berru, Jerzy-Javier, Dechamp, Jérôme, Vélard, Rémi, Roman, Antonio, Borel, Stéphan, Bouis, Renan, Vignoud, Lionel, Bedjaoui, Messaoud, Assous, Myriam   +11 more
core   +1 more source

3차원 집적회로에서 TSV의 고주파 모델링 및 TSV 불량 검출 방법에 관한 연구

, 2013
학위논문(박사) - 한국과학기술원 : 전기및전자공학과, 2013.2, [ ix, 86 p. ]In this dissertation, we propose a high-frequency scalable electrical model of a TSV. The proposed model includes not only TSV but also bump and re-distribution layer (RDL), which are additional ...
김주희, Kim, Joo-Hee
core   +1 more source

A novel three-phase switched capacitor multilevel inverter for PV applications. [PDF]

Sci Rep
Nayak N, Krishna AM, Jena K, Gupta KK, Kumar D, Dewangan NK.   +5 more
europepmc   +1 more source

Prediction of Individual Dynamic Thermal Sensation in Subway Commute Using Smart Face Mask. [PDF]

Biosensors (Basel), 2022
Fakir MH, Yoon SE, Mohizin A, Kim JK.
europepmc   +1 more source