Results 71 to 80 of about 8,987 (189)

Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration

Microsystems & Nanoengineering
The technology of through-silicon via (TSV) is extensively employed for achieving dense 3D integration. TSV facilitates the electrical interconnection of various layers of integrated circuits in a vertical orientation, thereby allowing for the creation ...
Tianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun, Sheng Liu   +7 more
doaj   +1 more source

Development and analytical validation of a targeted short‐read next generation sequencing‐based pharmacogenetic panel for comprehensive variant detection

British Journal of Pharmacology, Volume 183, Issue 16, Page 4735-4760, August 2026.
Abstract Background and Purpose Genomic profiling of patients for genetic variants that modify the effect of specific medications has many benefits, including the possibility of avoiding toxicities and ensuring an adequate effect of the medication. Our intention was to develop a comprehensive, high‐quality pharmacogenetic test panel for clinical use ...
Anna Gréen, Nils Johan Fredriksson, Michael Andresen, Jon Jonasson, Malin Lindqvist Appell, Henrik Gréen   +5 more
wiley   +1 more source

Effect of Tityus serrulatus venom on cytokine production and the activity of murine macrophages

Mediators of Inflammation, 2002
The purpose of this study was to investigate the effects of Tityus serrulatus venom (TSV) on murine peritoneal macrophages evaluated in terms of activation. The effects of crude TSV were analysed by detection of cytokines, oxygen intermediate metabolites
Vera L. Petricevich
doaj   +1 more source

Subconjunctival Injection of Viscoelastic Material for Leaking Sclerotomy in Transconjunctival Sutureless Vitrectomy

Journal of Ophthalmology, 2016
Aim. To evaluate the effectiveness of subconjunctivally injected viscoelastic material (VEM) for the self-sealing of leaking sclerotomy in transconjunctival sutureless vitrectomy (TSV). Methods.
Chung Hyun Lee, Soo Geun Joe, Sung Jae Yang   +2 more
doaj   +1 more source

One-year outcomes of 27-gauge versus 25-gauge pars plana vitrectomy for uncomplicated rhegmatogenous retinal detachment repair

International Journal of Retina and Vitreous, 2019
Background 27-gauge (27G) and 25-gauge (25G) transconjunctival sutureless vitrectomy (TSV) were considered equal about safety, effectiveness and vitrectomy time for the treatment of rhegmatogenous retinal detachment (RRD), although larger and long-term ...
Giancarlo Sborgia, Alfredo Niro, Luigi Sborgia, Maria Oliva Grassi, Samuele Gigliola, Mario R. Romano, Francesco Boscia, Alessandra Sborgia, Giovanni Alessio   +8 more
doaj   +1 more source

Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults

IEEE Access
Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically impact the entire chips.
Seokjun Jang, Donghyun Han, Sunghoon Kim, Dayoung Kim, Sungho Kang   +4 more
doaj   +1 more source

The Signal-Integrity Control Strategy of a TSV Array for a Chiplet-Based System

Micromachines
In this research, a signal-integrity control strategy of a through-silicon via (TSV) array for a Chiplet-based system is developed, based on the backpropagation neural network (BP-NN) model and particle swarm optimization algorithm with linear decreasing
Bosen Wang, Hongjian Su, Shengqi Zhang, Di Li, Dongdong Chen, Yintang Yang   +5 more
doaj   +1 more source

Multi-Objective Optimization for Through-Silicon via Structure Considering Thermomechanical Reliability and Electrical Performance. [PDF]

Micromachines (Basel)
Chen S, Hu W, Xue S, Zhang Q, Mu J, Liu S, Wu W, Diwu D, Wang C.   +8 more
europepmc   +1 more source

Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. [PDF]

Materials (Basel)
Szczotka N, Nashashibi S, Motyka A, Drozdek S, Leuthold J, Malecha K.   +5 more
europepmc   +1 more source

Total <i>Sanghuangporus vaninii</i> Extract Ameliorates Cisplatin-Induced Glioma Cell Death by Regulating Ferroptosis and Inflammation. [PDF]

Dose Response
Xu Y, Zhou J, Zhou X, Li Y, Yang S, Xue Z.   +5 more
europepmc   +1 more source