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Kinematics in ultra-precision grinding of WC moulds

International Journal of Nanomanufacturing, 2011
The target of this paper is the evaluation of process kinematics in ultra-precision grinding for the manufacturing of typical precision glass moulds (diameter 5 mm to 20 mm) with respect to part quality (form accuracy, surface roughness), machining time and process stability.
Ekkard Brinksmeier   +2 more
exaly   +2 more sources

Subsurface damage in sapphire ultra-precision grinding

Journal of Manufacturing Processes
Qingliang Zhao
exaly   +2 more sources

Modeling of Ultra-Precision ELID Grinding

Journal of Manufacturing Science and Engineering, 2006
The electrolytic in-process dressing (ELID) grinding is a new and an efficient process for ultra-precision finishing of hard and brittle materials. Unlike conventional grinding processes, the ELID grinding is a hybrid process that consists of a mechanical and an electrochemical process, and the performance of the ELID grinding process is influenced by ...
Fathima, K.   +3 more
openaire   +1 more source

Ultra-precision grinding of hard steels

Precision Engineering, 2001
Abstract Hardened bearing steel, M50, has been ultra-precision ground to produce an optical quality surface ( The development of optical quality surfaces is considered in terms of the processes occurring in the primary and secondary finishing zones of the cup-wheel, with the final surface finish enhanced by the burnishing action of worn CBN grits ...
D.J Stephenson   +3 more
openaire   +1 more source

Ultra Precision Grinding of Wafer Scale

Key Engineering Materials, 2012
Manufacturing moulds for the wafer-scale replication of precision glass optics sets new demands in terms of grinding tool lifetime and the processes to be applied. This paper will present different approaches to grinding processes and kinematics to machine wafer-scale tungsten carbide moulds with diameters of up to 100 mm and more than 100 single ...
Martin Hünten   +3 more
openaire   +1 more source

Grinding marks on ultra-precision grinding spherical and aspheric surfaces

International Journal of Precision Engineering and Manufacturing-Green Technology, 2017
Grinding marks are regard as a great obstacle to manufacture spherical and aspheric surfaces with higher surface quality, lower energy and wastage. The scallop-height was studied for optimizing the grinding parameters firstly to reduce its effect on grinding marks. Secondly, the expression of grinding points distribution was established to characterize
Bing Chen   +4 more
openaire   +1 more source

Modelling Surface Topography in Ultra-Precision Grinding Process

2020 3rd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM), 2020
Ultra-precision grinding is an often used manufacturing technology to achieve high surface quality of monocrystal silicon to satisfy severe requirements. However, the final ground surface is sensitive to the grinding conditions, such as the wheel type, processing parameters and the vibration, etc., which is not easy to systematacially research by ...
Qiuyan Wang   +3 more
openaire   +1 more source

New Tool Concepts for Ultra-Precision Grinding

Key Engineering Materials, 2012
This paper presents advanced tools for ultra precision grinding which offer a high wear resistance and can be used to generate high-quality parts with an ultraprecise surface finish. The first approach features defined dressed, coarse-grained, single layered, metal bonded diamond grinding wheels.
Ekkard Brinksmeier   +3 more
openaire   +1 more source

Improvement of grinding performance in ultra-precision grinding of lens mould by the help of megasonic coolant

International Journal of Manufacturing Technology and Management, 2006
In order to eliminate the difficulty in machining a tungsten carbide glass lens mould by using a fine diamond wheel, a new type of coolant supply method - the megasonic coolant supply method - is introduced. Using the megasonic coolant supply method, a substantial reduction in the error factor presently associated with the grinding wheel can be ...
Katsutoshi Tanaka   +5 more
openaire   +1 more source

A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers

Advanced Materials Research, 2010
A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon ...
Jun Zhang   +4 more
openaire   +1 more source

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