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An Investigation of the Cutting Strategy for the Machining of Polar Microstructures Used in Ultra-Precision Machining Optical Precision Measurement [PDF]
Micromachines, 2021 In this paper, an investigation of cutting strategy is presented for the optimization of machining parameters in the ultra-precision machining of polar microstructures, which are used for optical precision measurement.
Chi Fai Cheung, Cheung Chi Fai
exaly +3 more sources
Digital Twins-Based Smart Design and Control of Ultra-Precision Machining: A Review
Symmetry, 2021 Ultra-Precision Machining (UPM) is a kind of highly accurate processing technology developed to satisfy the manufacturing requirements of high-end cutting-edge products including nuclear energy producers, very large-scale integrated circuits, lasers, and
Jiewu Leng, Leng Jiewu
exaly +2 more sources
International Journal of Machine Tools and Manufacture, 2019 Micro-structured functional surfaces have achieved widespread applications in various advanced scientific, technological, industrial, and engineered fields due to their excellent performances, which are vitally limited by their feasible fabrication ...
Sandy To +2 more
exaly +2 more sources
A Review of Intelligentization System and Architecture for Ultra-Precision Machining Process
ProcessesThe intelligence of ultra-precision machining processes has become a research focus in the field of precision and ultra-precision manufacturing. Scholars have conducted some fragmented studies on the intelligence of ultra-precision machining processes ...
Jianjun Du, Guoqing Zhang
exaly +2 more sources
Energy consumption modeling of ultra-precision machining and the experimental validation
Energy, 2020 Enormous precision products are fabricated by precision machining technologies nowadays. Ultra-precision diamond cutting, which is one of the most applied machining ways in ultra-precision machining (UPM), figures the importance of precision ...
Sandy To
exaly +2 more sources
Micromachines, 2023 Silicon carbide wafer serves as an ideal substrate material for manufacturing semiconductor devices, holding immense potential for the future. However, its ultra-hardness and remarkable chemical inertness pose significant challenges for the surface ...
Qi Jin, Julong Yuan, Jianxing Zhou
doaj +1 more source
Micromachines, 2023 A self-excited oscillating pulsed abrasive water jet polishing method is proposed to solve the problems of low removal efficiency in traditional abrasive water jet polishing and the influence of an external flow field on the material surface removal rate.
Hong Zhang +5 more
doaj +1 more source
Study on the Influence of Sapphire Crystal Orientation on Its Chemical Mechanical Polishing
Applied Sciences, 2020 Sapphire has been the most widely used substrate material in LEDs, and the demand for non-C-planes crystal is increasing. In this paper, four crystal planes of the A-, C-, M- and R-plane were selected as the research objects.
Linlin Cao +6 more
doaj +1 more source
Experimental study on lapping ceramic balls with variable-radius groove plate
Advances in Mechanical Engineering, 2021 The method of lapping precision ball with variable-radius groove is developed in recent years. An experimental study on lapping ceramic balls with variable-radius groove was carried out.
Fenfen Zhou +5 more
doaj +1 more source
Micromachines, 2023 This paper pioneers the use of the extreme learning machine (ELM) approach for surface roughness prediction in ultra-precision milling, leveraging the excellent fitting ability with small datasets and the fast learning speed of the extreme learning ...
Suiyan Shang +4 more
doaj +1 more source