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Editorial for the Special Issue on "Frontiers of Ultra-Precision Machining". [PDF]
Micromachines (Basel), 2022 Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology [...]
Guo J, Wang C, Kang C.
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Ductile and brittle transition behavior of titanium alloys in ultra-precision machining [PDF]
Scientific Reports, 2018 Titanium alloys are extensively applied in biomedical industries due to their excellent material properties. However, they are recognized as difficult to cut materials due to their low thermal conductivity, which induces a complexity to their deformation
W. S. Yip, S. To
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Editorial for Special Issue on Ultra-Precision Machining of Difficult-to-Machine Materials. [PDF]
Micromachines (Basel)Difficult-to-machine materials, such as semiconductors [...]
Li C.
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Micromachines, 2023 Silicon carbide wafer serves as an ideal substrate material for manufacturing semiconductor devices, holding immense potential for the future. However, its ultra-hardness and remarkable chemical inertness pose significant challenges for the surface ...
Qi Jin, Julong Yuan, Jianxing Zhou
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Micromachines, 2023 A self-excited oscillating pulsed abrasive water jet polishing method is proposed to solve the problems of low removal efficiency in traditional abrasive water jet polishing and the influence of an external flow field on the material surface removal rate.
Hong Zhang +5 more
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Study on the Influence of Sapphire Crystal Orientation on Its Chemical Mechanical Polishing
Applied Sciences, 2020 Sapphire has been the most widely used substrate material in LEDs, and the demand for non-C-planes crystal is increasing. In this paper, four crystal planes of the A-, C-, M- and R-plane were selected as the research objects.
Linlin Cao +6 more
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Experimental study on lapping ceramic balls with variable-radius groove plate
Advances in Mechanical Engineering, 2021 The method of lapping precision ball with variable-radius groove is developed in recent years. An experimental study on lapping ceramic balls with variable-radius groove was carried out.
Fenfen Zhou +5 more
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Micromachines, 2023 This paper pioneers the use of the extreme learning machine (ELM) approach for surface roughness prediction in ultra-precision milling, leveraging the excellent fitting ability with small datasets and the fast learning speed of the extreme learning ...
Suiyan Shang +4 more
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The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer
Micromachines, 2020 Double-sides polishing technology has the advantages of high flatness and parallelism, and high polishing efficiency. It is the preferred polishing method for the preparation of ultra-thin sapphire wafer.
Zhixiang Chen +5 more
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Micromachines, 2023 Measuring the running accuracy of aerostatic bearings is challenging because of the high-precision requirements in rotational motion. This paper presents an ultra-high precision measurement method for aerostatic bearings using atomic force microscopy ...
Ping Wang +5 more
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