Results 181 to 190 of about 16,283 (340)
Acoustic field characteristics of ultrasonic linear phased array for an interface condition
, 2011 Zhan Xianglin +4 more
openalex +1 more source
Advanced Materials, EarlyView.A multidimensional molecular strategy optimizes the tribonegative layer by electrospinning PVDF‐HFP for dipole alignment and crystallinity, followed by 2D borophene doping to enhance conductivity and charge trapping. Integrated with Nylon‐66 nanofibers, the composite device delivers a record sensitivity of 53.8 ± 1.2 V kPa−1 at 3 Hz, enabling ultra ...
Sajib Roy +7 more
wiley +1 more source
Advanced Materials, EarlyView.Electrospun PAN‐MXene nanofibers and yarns integrate enhanced thermal conductivity, photothermal conversion, and triboelectric energy harvesting within a flexible architecture. Interconnected MXene networks promote efficient phonon transport, while their surface chemistry strengthens tribo‐negative behavior, enabling a high power density of 432.7 mW m ...
Ahmadreza Moradi +2 more
wiley +1 more source
Advanced Materials Interfaces, EarlyView.Hybrid piezoelectric scaffolds offer a promising route for Central Nervous System regeneration by combining structural and electrical cues to support neural stem cell growth. This review highlights their potential to overcome current challenges in neural tissue engineering by exploring porous hybrid materials, their biological interactions, and ...
Heather F. Titterton +2 more
wiley +1 more source
A Fast Method to Calculate the Spatial Impulse Response for 1-D Linear Ultrasonic Phased Array Transducers. [PDF]
Sensors (Basel), 2016 Zou C +5 more
europepmc +1 more source
Evaluation of Electrofusion Jointing of Polyethylene Pipes Using Phased Array Ultrasonic Testing and Microstructural Characterization [PDF]
Bouxali Keohavong +7 more
openalex +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Application of Ultrasonic Phased-array Techniques for Inservice Inspection
, 1993 Anton Erhard +2 more
openalex +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
Advanced Materials Technologies, EarlyView.This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source