Results 91 to 100 of about 4,373 (203)

Undeformed chip sizes in grinding process of regular surface texture generation

open access: yesArchive of Mechanical Engineering, 2019
The paper presents theoretical analysis and simulation results of the process of regular surface texture generation by grinding with the wheel shaped in a special way. Simple variant of the method consists in grinding with the wheel having single helical groove.
openaire   +1 more source

Numerical simulation of long and slender cylinders vibrating in axial flow applied to the Myrrha reactor [PDF]

open access: yes, 2012
Flow induced vibrations are an important concern in the design of nuclear reactors. One of the possible designs of the 4th generation nuclear reactors is a lead-cooled fast reactor of which MYYRHA is a prototype.
De Ridder, Jeroen   +3 more
core   +1 more source

Chaos-induced transparency in an ultrahigh-Q optical microcavity

open access: yes, 2012
We demonstrate experimentally a new form of induced transparency, i.e., chaos-induced transparency, in a slightly deformed microcavity which support both continuous chaotic modes and discrete regular modes with Q factors exceeding 3X?10^7.
Gong, Qihuang   +6 more
core   +1 more source

Simulation-based analysis of a biologically-inspired micropump with a rotating spiral inside a microchannel [PDF]

open access: yes, 2008
Microorganisms such as bacteria use their rotating helical flagella for propulsion speeds up to tens of tail lengths per second. The mechanism can be utilized for controlled pumping of liquids in microchannels.
Koz, Mustafa   +2 more
core  

Influence of the undeformed chip cross section in finishing turning of Inconel 718 with PCBN tools

open access: yesProcedia CIRP, 2018
Inconel 718 is a difficult-to-cut material due to its poor thermal conductivity, severe work hardening and high strength at high temperature. Machining of Inconel 718 with Polycrystalline Cubic Boron Nitride (PCBN) tools at high speed in finishing operations may lead to brittle fracture in the cutting tool because of the low toughness of PCBN inserts ...
Infante García, Diego   +4 more
openaire   +2 more sources

Stress effects of silica particles in a semiconductor package molding compound [PDF]

open access: yes, 2016
The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the
Burton, David Antony   +4 more
core  

A prediction model and experimental study on the grinding force of 3D-C/ZrC–SiC composites considering two-dimensional ultrasonic parameters

open access: yesJournal of Materials Research and Technology
Two-dimensional ultrasonic vibration-assisted grinding(TDUVAG) has a beneficial effect on the challenging processing characteristics of materials that are highly hard and brittle.
Yashuai Wang   +5 more
doaj   +1 more source

The numerical evaluation of the grinding process and the basic mechanics of grinding wheel wear [PDF]

open access: yes, 1965
During the production process development for the manufacture of an experimental supersonic aircraft , an unusual and difficult grinding problem was encountered.
Purcell, John
core  

Fluid-Structure Interaction with the Entropic Lattice Boltzmann Method

open access: yes, 2017
We propose a novel fluid-structure interaction (FSI) scheme using the entropic multi-relaxation time lattice Boltzmann (KBC) model for the fluid domain in combination with a nonlinear finite element solver for the structural part. We show validity of the
Chikatamarla, Shyam S.   +2 more
core   +1 more source

Grinding damage characteristics of silicon carbide ceramics

open access: yesJin'gangshi yu moliao moju gongcheng
ObjectivesTo explore the grinding damage mechanism and surface/subsurface damage distribution law of silicon carbide ceramics. MethodsCombined with single-particle scratching experiments, grinding experiments, and finite element simulation analyses, the ...
Hui YE, Jiafu XIE, Anjie NI
doaj   +1 more source

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