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Influence of Scratch Marks on Undeformed Chip Thickness in Ultra-Precision Cutting of Al-Mg Alloys
Key Engineering Materials, 2017Recently, high efficiency and performance have become necessary attributes of information equipment such as laser printers. Thus, demand has increased for optical scanning parts that reduce optical aberration, scatter, and diffraction are required in laser printers.
Keisuke Amaki +6 more
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Key Engineering Materials, 2010
Microgroove processes are carried out on Potassium Dihydrogen Phosphate (KDP) crystals of different crystalline orientation using diamond tool, the speed of groove is very low in order to avoid the influence of temperature. The main process characteristics are examined including the groove geometry, cutting forces and critical underformed chip ...
Hao Feng Chen +4 more
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Microgroove processes are carried out on Potassium Dihydrogen Phosphate (KDP) crystals of different crystalline orientation using diamond tool, the speed of groove is very low in order to avoid the influence of temperature. The main process characteristics are examined including the groove geometry, cutting forces and critical underformed chip ...
Hao Feng Chen +4 more
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Semiconductor Science and Technology, 2020
Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao +3 more
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Abstract In order to achieve the ductile mode cutting of silicon and avoid the generation of subsurface crack damage, the undeformed chip thickness in the diamond cutting process must be controlled below the critical value. Therefore, the critical undeformed chip thickness (CUCT) for the ductile mode cutting of silicon is studied in ...
Longxu Yao +3 more
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SAE International Journal of Materials and Manufacturing, 2020
<div>Grinding is a precision machining process that is widely used to achieve good surface integrity and inish. In order to study and reveal the influence of grinding process parameters such as grinding depth, feed speed, and wheel linear speed on the surface quality of the slider raceway, a series of single-factor grinding experiments under ...
Lu Zhang, Mingxia Kang, Wencheng Tang
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<div>Grinding is a precision machining process that is widely used to achieve good surface integrity and inish. In order to study and reveal the influence of grinding process parameters such as grinding depth, feed speed, and wheel linear speed on the surface quality of the slider raceway, a series of single-factor grinding experiments under ...
Lu Zhang, Mingxia Kang, Wencheng Tang
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Advanced Materials Research, 2011
Undeformed chip thickness is one of the most important parameters in grinding process, which is related to the entire abrasive grains in grinding simultaneously and changed periodically with time. Simplifying the geometric shape of abrasive grains ,the paper modifies the mathematic models of undeformed chip thickness by analytic method, establishes an ...
Jun Ming Wang +3 more
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Undeformed chip thickness is one of the most important parameters in grinding process, which is related to the entire abrasive grains in grinding simultaneously and changed periodically with time. Simplifying the geometric shape of abrasive grains ,the paper modifies the mathematic models of undeformed chip thickness by analytic method, establishes an ...
Jun Ming Wang +3 more
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Determining Undeformed Chip Thickness Models in Milling and its Verification during Wood Processing
Solid State Phenomena, 2017This paper presents a mathematical model of the maximum thickness and the chip area for the processes of cylindrical and profile milling of various materials, including wood. The analytical dependences connecting the geometry of the shear layer with the elements of the milling mode and cutter design parameters are determined.
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International Journal of Machine Tools and Manufacture, 2013
Abstract There is a distinct transition in the mode of material removal in machining of brittle materials if the undeformed chip thickness is below a critical threshold of submicron scale. It is believed that at such small scale of material removal, the energy required to extend pre-existing flaws in the microstructure of brittle material exceeds the
Arif, M. +3 more
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Abstract There is a distinct transition in the mode of material removal in machining of brittle materials if the undeformed chip thickness is below a critical threshold of submicron scale. It is believed that at such small scale of material removal, the energy required to extend pre-existing flaws in the microstructure of brittle material exceeds the
Arif, M. +3 more
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10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics, 2021
Shanyi Ma +3 more
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Shanyi Ma +3 more
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