Results 51 to 60 of about 85 (61)

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Journal of the Electrochemical Society, 2013
Thomas Moffat, Daniel Josell
exaly  

Fully Inkjet Printed RF Inductors and Capacitors Using Polymer Dielectric and Silver Conductive Ink With Through Vias

IEEE Transactions on Electron Devices, 2015
Garret McKerricher, Atif Shamim
exaly  

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Microelectronics Reliability, 2013
Tengfei Jiang, Qiu Zhao, Jay Im
exaly  

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Electrochimica Acta, 2013
Fumihiro Inoue, Harold Philipsen, Silvia Armini   +2 more
exaly  

Design of Periodic Shorting-Vias for Suppressing the Fundamental Mode in Microstrip Leaky-Wave Antennas

IEEE Transactions on Antennas and Propagation, 2015
Juhua Liu, Yuanxin li
exaly  

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Journal of Electronic Materials, 2012
Byoung-Joon Kim, Nobumichi Tamura, Martin Kunz   +2 more
exaly  

Higher‐mode textile patch antenna with embroidered vias for on‐body communication

IET Microwaves, Antennas and Propagation, 2016
William G Whittow, Antonis A Alexandridis   +1 more
exaly  

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

Nature Electronics
Dong Hae Ho, Ling Li, Michael D Bartlett
exaly  

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014
exaly  

Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias

Jom, 2011
exaly