Results 51 to 60 of about 84 (61)

Broadband Monopolar Microstrip Patch Antenna With Shorting Vias and Coupled Ring

IEEE Antennas and Wireless Propagation Letters, 2014
Juhua Liu, Shao Y Zheng, Yuanxin li
exaly  

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Applied Physics Letters, 2012
Jay Im, Rui Huang
exaly  

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Journal of the Electrochemical Society, 2013
Thomas Moffat, Daniel Josell
exaly  

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Electrochimica Acta, 2013
Fumihiro Inoue, Harold Philipsen, Silvia Armini   +2 more
exaly  

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

Nature Electronics
Dong Hae Ho, Ling Li, Michael D Bartlett
exaly  

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Microelectronics Reliability, 2013
Tengfei Jiang, Qiu Zhao, Jay Im
exaly  

Fully Inkjet Printed RF Inductors and Capacitors Using Polymer Dielectric and Silver Conductive Ink With Through Vias

IEEE Transactions on Electron Devices, 2015
Garret McKerricher, Atif Shamim
exaly  

Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias

Nature Electronics
Subir Ghosh, Yikai Zheng, Zhiyu Zhang
exaly  

Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias

Jom, 2011
exaly  

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014
exaly