Results 41 to 50 of about 70 (60)

Compact Wideband Circularly Polarized Dielectric Resonator Antenna With Dielectric Vias

IEEE Antennas and Wireless Propagation Letters, 2022
Changwu Tong, Hauke Ingolf Kremer, Nan Yang   +2 more
exaly  

Wetting process of copper filling in through silicon vias

Applied Surface Science, 2015
Liming Gao
exaly  

Stress measurements in tungsten coated through silicon vias for 3D integration

Thin Solid Films, 2013
S Escoubas, F Schrank
exaly  

Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
Leung Tsang
exaly  

Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations

Microwave and Optical Technology Letters, 2001
Leung Tsang, Chung-Chi Huang, Vikram Jandhyala   +2 more
exaly  

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Microelectronic Engineering, 2010
Qianwen Chen, Zheyao Wang, Jian Cai
exaly  

Analysis of a large number of vias and differential signaling in multilayered structures

IEEE Transactions on Microwave Theory and Techniques, 2003
Leung Tsang, Chung-Chi Huang, V Jandhyala   +2 more
exaly  

Crosstalk Analysis for Different Types of PCB VIAS Models at High-Frequency Transmission

SpringerBriefs in Applied Sciences and Technology, 2023
exaly  

High aspect ratio copper through-silicon-vias for 3D integration

Microelectronic Engineering, 2008
Zheyao Wang, Qianwen Chen, Jian Cai
exaly  

Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
Paragkumar A Thadesar, Muhannad S Bakir
exaly