Results 51 to 59 of about 62,118 (59)

Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
Paragkumar Thadesar
exaly  

Morfologia das vias aéreas superiores em pacientes com síndrome de Down sob sedação com dexmedetomidina

Revista Brasileira De Anestesiologia, 2016
Rupa Radhakrishnan, Robert Fleck
exaly  

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias

Microelectronics Reliability, 2014
Eric Beyne, Íngrid de Wolf, Yunlong Li   +2 more
exaly  

New Vias in DBC

Microelectronics International, 2000
exaly  

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2014
David Z Pan, Sung Kyu Lim
exaly  

Contacts and Vias

2016
exaly  

Signal Integrity Analysis Between Continuous Vias and Indirect Vias on RDL Circuits

Sung-Mao Wu
exaly  

Copper-filled through wafer vias with very low inductance

C S Patel, K A Jenkins
exaly  

Development of through glass vias (TGV) and through quartz vias (TQV) for advanced packaging

2017
exaly