Results 101 to 107 of about 5,407,858 (107)
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Electromigration reliability of tungsten and aluminum vias and improvements under AC current stress
IEEE Transactions on Electron Devices, 1993N W Cheung
exaly
Resistance Determination for Sub-100-nm Carbon Nanotube Vias
IEEE Electron Device Letters, 2015Changjian Zhou +2 more
exaly
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias
Microelectronics Reliability, 2014Yunlong Li +2 more
exaly

