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Copper-filled through wafer vias with very low inductance

C S Patel, K A Jenkins
exaly  

Development of through glass vias (TGV) and through quartz vias (TQV) for advanced packaging

2017
exaly  
síndrome de wolff-parkinson-white
ablação por cateter
vetorcardiografia
crioterapia
criomapeamento
vias ântero-septais
ablação
para-hissiana
eletrocardiografia
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