Results 81 to 90 of about 5,407,858 (107)

On the use of vias in conductor-backed coplanar circuits

, 2002
W. Haydl
semanticscholar   +1 more source

Design and Analysis of a Low-Profile and Broadband Microstrip Monopolar Patch Antenna

IEEE Transactions on Antennas and Propagation, 2013
Juhua Liu, Q. Xue, H. Wong, H. Lai, Y. Long   +4 more
semanticscholar   +1 more source

Three-dimensional silicon integration

IBM Journal of Research and Development, 2008
J. Knickerbocker, P. Andry, B. Dang, R. Horton, M. Interrante, C. Patel, R. Polastre, K. Sakuma, R. Sirdeshmukh, E. Sprogis, S. M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, C. Tsang, B. Webb, S. Wright   +15 more
semanticscholar   +1 more source

The shared leadership of teams: A meta-analysis of proximal, distal, and moderating relationships

, 2014
Vias Nicolaides, K. LaPort, Tiffani R. Chen, Alan J. Tomassetti, Eric J. Weis, S. Zaccaro, Jose M. Cortina   +6 more
semanticscholar   +1 more source

Compact Wideband Circularly Polarized Dielectric Resonator Antenna With Dielectric Vias

IEEE Antennas and Wireless Propagation Letters, 2022
Changwu Tong, Hauke Ingolf Kremer, Nan Yang   +2 more
exaly  

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2012
Vijay Sukumaran, T. Bandyopadhyay, Venky Sundaram, Rao R. Tummala   +3 more
semanticscholar   +1 more source

Wetting process of copper filling in through silicon vias

Applied Surface Science, 2015
Liming Gao
exaly  

Stress measurements in tungsten coated through silicon vias for 3D integration

Thin Solid Films, 2013
S Escoubas, F Schrank
exaly  

Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
Leung Tsang
exaly  

Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations

Microwave and Optical Technology Letters, 2001
Leung Tsang, Chung-Chi Huang, Vikram Jandhyala   +2 more
exaly