Results 81 to 90 of about 6,631 (94)

Imprint of sub‐25 nm vias and trenches in polymers

Applied Physics Letters, 1995
Stephen Y Chou
exaly  

Investigation of Shorting Vias for Suppressing the Open Stopband in an SIW Periodic Leaky-Wave Structure

IEEE Transactions on Microwave Theory and Techniques, 2018
Wenlong Zhou, Juhua Liu, Yunliang Long
exaly  

Wetting process of copper filling in through silicon vias

Applied Surface Science, 2015
Liming Gao
exaly  

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

IEEE Electron Device Letters, 2012
Di Jiang, Yifeng Fu, Kjell O Jeppson
exaly  

Analysis of a large number of vias and differential signaling in multilayered structures

IEEE Transactions on Microwave Theory and Techniques, 2003
Leung Tsang
exaly  

A Double-Layer Transmitarray Antenna Using Malta Crosses With Vias

IEEE Transactions on Antennas and Propagation, 2016
Wenxing An, Shenheng Xu, Fan Yang
exaly  

High aspect ratio copper through-silicon-vias for 3D integration

Microelectronic Engineering, 2008
Zheyao Wang
exaly  

Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations

Microwave and Optical Technology Letters, 2001
Leung Tsang
exaly  

Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
Leung Tsang
exaly  

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

Nature Electronics
Dong Hae Ho, , Michael D Bartlett
exaly