Results 61 to 70 of about 62,163 (82)

Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding [PDF]

open access: yes, 2013
Wipf, C.   +6 more
core   +1 more source

Wetting process of copper filling in through silicon vias

Applied Surface Science, 2015
Liming Gao
exaly  

Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations

Microwave and Optical Technology Letters, 2001
Leung Tsang
exaly  

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