Results 71 to 80 of about 62,163 (82)

High aspect ratio copper through-silicon-vias for 3D integration

Microelectronic Engineering, 2008
Zheyao Wang, Jian Cai, Qianwen Chen
exaly  

Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects

Micromachines, 2022
exaly  

Electromigration reliability of tungsten and aluminum vias and improvements under AC current stress

IEEE Transactions on Electron Devices, 1993
N W Cheung
exaly  

Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
Paragkumar Thadesar
exaly  

Morfologia das vias aéreas superiores em pacientes com síndrome de Down sob sedação com dexmedetomidina

Revista Brasileira De Anestesiologia, 2016
Rupa Radhakrishnan, Robert Fleck
exaly  

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias

Microelectronics Reliability, 2014
Eric Beyne, Íngrid de Wolf, Yunlong Li   +2 more
exaly  

New Vias in DBC

Microelectronics International, 2000
exaly  

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2014
David Z Pan, Sung Kyu Lim
exaly  

Contacts and Vias

2016
exaly  

Signal Integrity Analysis Between Continuous Vias and Indirect Vias on RDL Circuits

Sung-Mao Wu
exaly