Results 71 to 80 of about 5,407,858 (107)
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Predicting resistance to chemotherapy using chromosomal instability signatures
Nature GeneticsChemotherapies are often given without precision biomarkers, exposing patients to toxic side effects without guaranteed benefit. Here we present chromosomal instability signature biomarkers that identify resistance to platinum-, taxane- and anthracycline-
J. Thompson +31 more
semanticscholar +1 more source
Leukemia
Multiple myeloma (MM) is a malignancy of immunoglobulin-secreting plasma cells that represents 10% of all hematological cancers and remains essentially incurable, despite recent advances.
Simone Zocchi +12 more
semanticscholar +1 more source
Multiple myeloma (MM) is a malignancy of immunoglobulin-secreting plasma cells that represents 10% of all hematological cancers and remains essentially incurable, despite recent advances.
Simone Zocchi +12 more
semanticscholar +1 more source
Inflammasome targeting for periodontitis prevention is sex-dependent
Proceedings of the National Academy of Sciences of the United States of AmericaInflammasome initiates inflammation via the maturation of IL-1β. Periodontitis is a prevalent, male-biased disease characterized by inflammation-driven bone loss, yet the mechanism(s) of this sex-bias is unknown.
T. Alves +29 more
semanticscholar +1 more source
A Double-Layer Transmitarray Antenna Using Malta Crosses With Vias
IEEE Transactions on Antennas and Propagation, 2016Wenxing An +3 more
semanticscholar +1 more source
Ablação de Arritmias em Idades Pediátricas
, 2005Antônio Pires +7 more
semanticscholar +1 more source
High-Density Through Silicon Vias for 3-D LSIs
Proceedings of the IEEE, 2009M. Koyanagi, T. Fukushima, Tetsu Tanaka
semanticscholar +1 more source
O Custo Social das Obrigações Tributárias Acessórias
, 2012Hugo Mendes Plutarco +2 more
semanticscholar +1 more source
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias
IEEE Journal of Solid-State Circuits, 2006J. Knickerbocker +10 more
semanticscholar +1 more source
Damascene copper electroplating for chip interconnections
IBM Journal of Research and Development, 1998P. C. Andricacos +4 more
semanticscholar +1 more source
Demystifying 3D ICs: the pros and cons of going vertical
IEEE Design & Test of Computers, 2005W. R. Davis +8 more
semanticscholar +1 more source

