Results 201 to 210 of about 4,969 (222)
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Surrogate-based process optimization for reducing warpage in injection molding
Journal of Materials Processing Technology, 2009Yuehua Gao, Xicheng Wang
exaly
Accurate prediction of PQFP warpage
Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies, 2002G. Kelly +6 more
openaire +1 more source
Minimization of warpage for wafer level package using response surface method
International Journal of Precision Engineering and Manufacturing, 2016Sung-Jun Park
exaly
Research of BGA Package Warpage
Proceedings of the 1992 Annual Meeting of JSME/MMD, 2000Hidehisa SAKAI +5 more
openaire +1 more source