Results 41 to 50 of about 7,259 (245)
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich +3 more
wiley +1 more source
Spark plasma sintering enables rapid processing of porous organic polymer (POP) from fine powders to a freestanding and mechanically robust monolith. The sintering process retains the CO2 adsorption capacity and CO2/N2 selectivity, making the monolith more suitable as a solid sorbent for practical carbon capture applications.
Duan Li +4 more
wiley +1 more source
Path Optimization of Laser Welding for Large-Scale Tube-to-Tubesheet
To address issues of residual stress concentration and deformation in large-scale multi-seam laser welding of tube-to-tubesheet, we established a 12 mm thick Q235 steel simulation model. The model considers the material’s high-temperature performance and
Xuqiang Kang +3 more
doaj +1 more source
Membrane Wrapping for High Capacity and Rapidly Switchable Adhesives
A membrane‐wrapping mechanism enables high‐capacity, rapidly switchable adhesion by coupling suction, friction, and adhesion. Broadband performance is achieved in dry and underwater conditions, allowing fast, reversible manipulation of objects of diverse sizes and shapes, from delicate eggs and berries to flat, complex, or heavy objects. These outcomes
Yeunhee Kim +2 more
wiley +1 more source
Numerical simulation of the welding process is critical for predicting and controlling structural deformation. Previous numerical studies have predominantly focused on investigating the welding deformation of simple structures.
Bo Wang +5 more
doaj +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Influence of Welding Quality Sequence on Welding of Bit Leg
The cone bit is formed by welding of 3 bit legs, but he deformation caused by welding has a great influence on the geometry and performance of the cone bit.
Wu Zebing +4 more
doaj
The use of I-Core sandwich panel has increased in cruise ship deck structure since it can provide similar bending strength with conventional stiffened plate while keeping lighter weight and lower web height. However, due to its thin plate thickness, i.e.
Jae Woong Kim +3 more
doaj +1 more source
Automat optical inspection (AOI) techniques in semiconductor fabrication can be leveraged in battery manufacturing, enabling scalable detection and analysis of electrode‐ and cell‐level imperfections through AI‐driven analytics and a digital‐twin framework.
Jianyu Li, Ertao Hu, Wei Wei, Feifei Shi
wiley +1 more source
Novel Functional Materials via 3D Printing by Vat Photopolymerization
This Perspective systematically analyzes strategies for incorporating functionalities into 3D‐printed materials via Vat Photopolymerization (VP). It explores the spectrum of achievable functionalities in recently reported novel materials—such as conductive, energy‐storing, biodegradable, stimuli‐responsive, self‐healing, shape‐memory, biomaterials, and
Sergey S. Nechausov +3 more
wiley +1 more source

