Results 211 to 220 of about 570,417 (263)

About the Evolution of Wire Tool Performance in Wire EDM

CIRP Annals, 1992
Since the commercial introduction of wire EDM on the market, end 1969 begin 1970, the overall performance of the wire EDM has undergone a tremendous evolution. Six major contributing factors have been responsible for this important change. One of these.
D.F. Dauw, L. Albert
openaire   +1 more source

Machinability of gas metal arc based 3D printed Al-Mg 5356 alloy using wire-EDM

Engineering Research Express
Wire-Arc Additive Manufactured (WAAM) is relatively new method of metal 3D printing in which the raw material is heated by the gas metal arc and the molten metal pool is deposited layer-by-layer using a computer numerically controlled axis drive system ...
D. Doreswamy, Vijeesh Vijayan, Krrish Jain, S. K. Bhat   +3 more
semanticscholar   +1 more source

Knowledge-based system for wire-EDM

The International Journal of Advanced Manufacturing Technology, 1988
The paper proposes an all-round solution to a number of problems, related to the wire-EDM process. The solution is based on the development of a Knowledge-based system. It enables process monitoring and control, making use of a reliable rupture probability parameter.
R. Snoeys, W. Dekeyser
openaire   +2 more sources

Predictive analysis and multi objective optimization of wire-EDM process using ANN

, 2021
Metal Matrix Composites (MMCs) plays very important role in structural, aerospace and automotive industries, because of their good properties like light weight, high specific strength and good wear resistance. Among various nonconventional machines, wire
M. Arunadevi, C. Prakash
semanticscholar   +1 more source

CNC Automatic Programming System for Wire-EDM

1999
This paper introduces a developed CAM system for wire-EDM to automatically select the sequencing of the wire path considering fixation stability. The system creates technological aspects based on geometry features. Many of the wire cutting techniques such as trim cut, correction, taper angle, threading & breaking points, and the standard radius are ...
Tawfik T. El-Midany, Ahmed Elkeran, H. T. Radwan   +2 more
openaire   +1 more source

Wire-EDM machinability investigation on quaternary Ni44Ti50Cu4Zr2 shape memory alloy

, 2021
Shape memory alloy (SMA), also called memory metal, is a smart material that exhibits unique shape memory effect and superelasticity properties. NiTi alloys attract researchers because of their myriad applications in areas such as aerospace, medicine ...
C. Balasubramaniyan, K. Rajkumar, S. S
semanticscholar   +1 more source

Experimental investigation of wire EDM parameters during machining of fabricated hybrid Al/(SiC+ZrO2+NiTi)-MMC

Advances in Materials and Processing Technologies, 2022
Nowadays, advanced engineering materials are gradually becoming more attractive to the industries because of their high fatigue strength, hardness, thermal shock resistance, attractive strength to weight ratio, etc.
S. K. Maurya, Chander Kant Susheel, A. Manna   +2 more
semanticscholar   +1 more source

Study on modeling of wire EDM process

Journal of Materials Processing Technology, 1997
Abstract Wire electrical discharge machining (WEDM) technology has been used widely in production, aerospace/aircraft, medical and virtually all areas of conductive material machining. Its complexity and stochastic nature have stimulated numerous attempts to model it accurately.
Spedding, Trevor A, Wang, Z Q
openaire   +1 more source

A novel approach of GEF and GA for the optimization of multi-objective wire EDM process during the machining of DC53 super alloy

, 2021
In components manufacturing, the Wire EDM is more popular due to its outstanding features of high dimensional accuracy, lower cost of production and good surface finish as there is no physical contact between the wire and work piece.
Satish Kumar, A. Gupta, P. Chandna, G. Bhushan, Anish Kumar   +4 more
semanticscholar   +1 more source

Investigation of silicon wafering by wire EDM

Journal of Materials Science, 1992
The new technology of silicon wafering by wire electrodischarge machining (EDM) was investigated to determine its mechanism of current-conducting and material removal. Target materials were n-type single-crystal silicon ingots with the resistivity of 7–15 cmΩ. It was found that the surface potential barrier of the semiconductors had a dominating effect
Y. F. Luo, C. G. Chen, Z. F. Tong
openaire   +1 more source