Results 211 to 220 of about 516,605 (304)

Microfluidic Hydroporation Platform for Effective Allogeneic CAR‐T Cell Production and Subsequent Functional Cytotoxicity Analysis

open access: yesAdvanced Materials Technologies, EarlyView.
The hydroporator platform employs controlled hydrodynamic deformation for efficient mRNA and CRISPR/Cas9 delivery into primary human T cells, enabling allogeneic CAR‐T cell manufacturing. It preserves cell functionality and drives potent gene editing, CAR expression, and tumor cytotoxicity, while feature‐based analysis links these functional outcomes ...
Soohyun Jeon   +6 more
wiley   +1 more source

Recent Advances of Slip Sensors for Smart Robotics

open access: yesAdvanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang   +8 more
wiley   +1 more source

Hydrogel‐Based Functional Materials: Classifications, Properties, and Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Conductive hydrogels have emerged as promising materials for smart wearable devices due to their outstanding flexibility, multifunctionality, and biocompatibility. This review systematically summarizes recent progress in their design strategies, focusing on monomer systems and conductive components, and highlights key multifunctional properties such as
Zeyu Zhang, Zao Cheng, Patrizio Raffa
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

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