Results 21 to 30 of about 86,576 (325)

Peanut Defect Identification Based on Multispectral Image and Deep Learning

Agronomy, 2023
To achieve the non-destructive detection of peanut defects, a multi-target identification method based on the multispectral system and improved Faster RCNN is proposed in this paper.
Yang Wang, Zhao Ding, Jiayong Song, Zhizhu Ge, Ziqing Deng, Zijie Liu, Jihong Wang, Lifeng Bian, Chen Yang   +8 more
doaj   +1 more source

Direct Defect-Level Analysis of Metal–Insulator–Metal Capacitor Using Internal Photoemission Spectroscopy

IEEE Journal of the Electron Devices Society, 2021
Barrier height ( $\phi _{b}$ ), trap state, bandgap ( $E_{g}$ ), and band alignment information of the metal–ZrO2–metal capacitor have been extracted using internal photoemission (IPE) system.
Tae Jin Yoo, Hyeon Jun Hwang, Soo Cheol Kang, Sunwoo Heo, Ho-In Lee, Young Gon Lee, Hokyung Park, Byoung Hun Lee   +7 more
doaj   +1 more source

First-principles study on the electronic structure and catalytic properties of two-dimensional MX2N4 systems (M = Ti, Zr; X = Si, Ge)

Results in Physics, 2023
Recently, the two-dimensional MA2Z4 family with a seven-atom layer structure (experimentally synthesized a MoSi2N4 monolayer), which has good stability and exhibits semiconductivity, providing a platform for photocatalytic hydrolysis studies of two ...
Yi Wang, Guang Wang, Mengya Huang, Zhengli Zhang, Jihong Wang, Ding Zhao, Xiang Guo, Xuefei Liu   +7 more
doaj   +1 more source

2D Junction Profiling on Semiconductor Device Reliability Fail [PDF]

Microscopy and Microanalysis, 2017
Y.Y. Wang, Jochonia Nxumalo, Ahmad D. Katnani, Dimitris P. Ioannou, J. Brown, K. Bandy, Michael P. MacDonald, J. Bruley   +7 more
openalex   +2 more sources

WBG-Based PEBB Module for High Reliability Power Converters

IEEE Access, 2021
The increasing presence of power electronic converters in the modern world – from electric vehicles, up to industrial applications – brings up concerns about their reliability, especially in the case of the Wide Band-Gap (WBG) devices ...
Sebastian Baba, Serafin Bachman, Marek Jasinski, Marcin Zelechowski   +3 more
doaj   +1 more source

Kinetic calculation analysis of Ga deposition on the morphology evolution of GaAs quantum ring

Materials Research Express, 2021
GaAs Quantum Ring (QR) was gained on GaAs (001) by Droplet Epitaxy (DE), and the microscopic morphology of the GaAs samples was observed by Scanning Tunnel Microscope (STM).
Qi-Zhi Lang, Xiang Guo, Zi-Jiang Luo, Zhao Ding   +3 more
doaj   +1 more source

Analysis of High-Temperature Data Retention in 3D Floating-Gate nand Flash Memory Arrays

IEEE Journal of the Electron Devices Society, 2023
In this paper, we present a detailed experimental investigation of high-temperature data retention in 3D floating-gate NAND Flash memory arrays. Data reveal that charge detrapping from the cell tunnel oxide and depassivation of traps in the string ...
Gerardo Malavena, Mattia Giulianini, Luca Chiavarone, Alessandro S. Spinelli, Christian Monzio Compagnoni   +4 more
doaj   +1 more source

The magnetic, optical and electronic properties of Mn–X(X = O, Se, Te, Po) co-doped MoS2 monolayers via first principle calculation

Materials Research Express, 2020
The magnetic and optical properties studies in monolayer transition-metal dichalcogenides have attracted attention because of the manufacture spintronic, electronic and photonic devices.
Qi-Zhi Lang, Yan-Bin Huang, Jie-Min Wei, Yi Wang, Xiang Guo, Zi-Jiang Luo, Zhao Ding   +6 more
doaj   +1 more source

Technological sustainable materials and enabling in semiconductor memory industry: A review

e-Prime: Advances in Electrical Engineering, Electronics and Energy, 2023
This paper provides an overview of current and future deployment of recyclable direct materials and sustainable materials through recycling of interconnect metals used in semiconductor assembly and packaging. Also, with the aim to study the key technical
Chong Leong Gan, Min-Hua Chung, Yung-Sheng Zou, Chen-Yu Huang, Hem Takiar   +4 more
doaj   +1 more source

Package Hermeticity Testing with Thermal Transient Measurements [PDF]

, 2008
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments.
Rencz, M., Vass-Varnai, Andras
core   +2 more sources