Results 211 to 220 of about 589,497 (305)

High-power pulsed-laser ablation of aluminum alloy: Simulation model and experimental validation. [PDF]

PLoS One
Chen Q, Hou B, Li Y, Wang Z, Zhao J, Dong K.   +5 more
europepmc   +1 more source

Laser‐Induced Local De‐Doping in Organic Semiconductors

Advanced Materials Technologies, EarlyView.
The polymer PBTTT‐C14 doped with the small molecule acceptor F4TCNQ is considered as a benchmark material system. Mask‐free, microscale patterning of the doping level via laser‐induced heating and sublimation of dopant molecules is shown. Controlling laser irradiance and swath spacing allows dopant level control with laser‐limited resolution, opening ...
Christian Rainer, Aleksandr Perevedentsev, Daniel Ryklin, Rasmus R. Schröder, Gerardo Hernandez‐Sosa, Uli Lemmer   +5 more
wiley   +1 more source

Investigation of Electromechanical Characteristics of Piezoelectric Unimorph Actuators Under Thermal-Vacuum Conditions Relevant to Low Earth Orbit. [PDF]

Micromachines (Basel)
Šišovas L, Juknevičius L, Čeponis A.
europepmc   +1 more source

In‐House Manufacturing of 3D ECM Culture Chips via Vacuum Thermoforming for Enhanced Imaging Applications

Advanced Materials Technologies, EarlyView.
Desktop vacuum thermoforming enables rapid, low‐cost fabrication of 96‐channel polystyrene culture chips with very thin imaging interfaces. The resulting platform supports cell lines, primary cells, and patient‐derived organoids, and enables high‐resolution confocal microscopy and single‐cell visualization, providing an accessible approach for advanced
Aleksandra Fomina, Adam Tam, Jennifer Lam, Nila C. Wu, Nancy T. Li, Alison P. McGuigan   +5 more
wiley   +1 more source

Novel phase-controlled Al_2.66O_3.99/iron oxide nanocomposites for rapid Cu(II) removal from acidic water. [PDF]

Discov Nano
Gholizadeh Z, Al-Awady MJ, Aliannezhadi M.   +2 more
europepmc   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

Advanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na, Jaeho Seo, Sungwoo Yang, Wonjin Lee, James Sangmin Choo, Sangjae Kim, Sanghyun Park, Juhyuk Park   +7 more
wiley   +1 more source

Innovation in Aluminum Dross Processing: Comprehensive Strategies for Safe Disposal and Efficient Utilization in China. [PDF]

Materials (Basel)
Wang R, Gao F, Chen D, Yin Z, Li M, Mao K, Li C.   +6 more
europepmc   +1 more source

Copper Electroplated TPMS Polymer Lattices for Lightweight Absorption Dominant Electromagnetic Interference Shielding

Advanced Materials Technologies, EarlyView.
Copper electroplating transforms lightweight 3D‐printed TPMS polymer lattices into effective electromagnetic shields. Topology, relative density, and conductive seed layer continuity govern copper penetration, electrical resistance, and attenuation. SEA consistently exceeds SER, while 35% RD Diamond lattice gives the best performance, reaching 48.72 dB
Aman Al Khatib, Fares AlAwwa, Naod Mogos, Abdallah Kamal, Kin Liao, Marwan El Rich, Wael Zaki   +6 more
wiley   +1 more source

Friction Stir Joining of Structural Polymers and Aluminum Alloys-A Direct Comparison of Mechanical Behavior and Rheological Effects on Dissimilar Metal-Polymer Joints. [PDF]

Polymers (Basel)
Correia AN, Coelho B, Leal CR, Fernandes SN, Infante V, Vilaça P.   +5 more
europepmc   +1 more source