Results 191 to 200 of about 116,969 (302)
A review of SPAD array chip design for direct time-of-flight LiDAR. [PDF]
Mo L, Huang S, Yang Y, Ren TL.
europepmc +1 more source
Bioactive conductive Ti3C2Tx‐Ce hydrogels with with scavenging ROS and alleviating neuronal mitochondrial dysfunction are exploited for SCI treatment. This functionality is attributed to interfacial activation modification of Ti3C2Tx with Ce3+ ions to in‐situ form Ce(OH)x‐mediated protective layer, which is beneficial to enabling stable intracellular ...
Weikang Wang +12 more
wiley +1 more source
Accelerating hybrid XOR-CNF Boolean satisfiability problems natively with in-memory computing. [PDF]
Im H +16 more
europepmc +1 more source
This work presents a rate‐adaptive site transformation strategy in Ag‑ethylenediamine intercalated Co9S8, which not only enables parallel water dissociation and H* adsorption, but also allows the catalyst to provide more active sites under high demand, removing a major bottleneck. The catalyst achieves a record current density of 4.2 A cm−2@2.0 V, with
Yongqi Ye +3 more
wiley +1 more source
Design and test of analog-to-digital converters with enhanced test strategies using built in self test. [PDF]
J R, V G, S SD, C E.
europepmc +1 more source
Atomic Layer Deposition in Transistors and Monolithic 3D Integration
Transistors are fundamental building blocks of modern electronics. This review summarizes recent progress in atomic layer deposition (ALD) for the synthesis of two‐dimensional (2D) metal oxides and transition‐metal dichalcogenides (TMDCs), with particular emphasis on their enabling role in monolithic three‐dimensional (M3D) integration for next ...
Yue Liu +5 more
wiley +1 more source
Photonic edge intelligence chip for multi-modal sensing, inference and learning. [PDF]
Zhang S +8 more
europepmc +1 more source
Multi‐Functional ZnO–Te Heterojunction Devices Enabling Compact Frequency Quadrupler
Wafer‐scale ZnO–Te heterojunction devices featuring tunable double negative differential transconductance (D‐NDT) are demonstrated at ≤ 200°C. Leveraging this unique characteristic, a single‐stage frequency quadrupler is realized, achieving a 64%–75% reduction in device count.
Jae Hyeon Jun +8 more
wiley +1 more source
Integrated photonic 3D tensor processing engine. [PDF]
Wu Y +6 more
europepmc +1 more source

