Results 211 to 218 of about 583,609 (218)
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Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner

Microelectronics Reliability, 2014
Yingtao Ding   +2 more
exaly  

Analytical solution for the 1D consolidation of unsaturated multi-layered soil

Computers and Geotechnics, 2014
Zhendong Shan, Daosheng Ling
exaly  

Stress analytical solution for an infinite plane containing two holes

International Journal of Mechanical Sciences, 2017
Aizhong Lu, Ning Zhang
exaly  

Analytical solution methods for the fuzzy weighted average

Information Sciences, 2012
Jerry Mendel, Xinwang Liu, Dongrui Wu
exaly  

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