Results 171 to 180 of about 14,384 (217)

Advances in Thermoelectric Materials Research. [PDF]

Small Sci
Zhu T.
europepmc   +1 more source

Hybridizing anomalous Nernst effect in artificially tilted multilayer based on magnetic topological material. [PDF]

Nat Commun
Hirai T, Ando F, Sepehri-Amin H, Uchida KI.   +3 more
europepmc   +1 more source

Thermoelectric bismuth telluride nanostructures fabricated by electrodeposition within flexible templates. [PDF]

Heliyon
Cervino-Solana P, Ramirez-Peral MJ, Martín-González MS, Caballero-Calero O.   +3 more
europepmc   +1 more source

Enhanced Thermoelectric Performance of BST/WSe₂ Heterostructures Through Defect-Driven Microstructural Modifications. [PDF]

Small Methods
Giri K, Wang YL, Wu YT, Chen CH.
europepmc   +1 more source

Modulation of Bi_xSb_2-xTe₃ Alloy Application Temperature via Optimizing Material Composition. [PDF]

Materials (Basel)
Ma S, Li J, Du D, Ruan X, Cao M, Lin M, Hua Q, Luo Q, Tang P, Guan J, Yu J.   +10 more
europepmc   +1 more source

One Stone, Three Birds: Feasible Tuning of Barrier Heights Induced by Hybridized Interface in Free-Standing PEDOT@Bi₂Te₃ Thermoelectric Films. [PDF]

Polymers (Basel)
Feng L, Wang F, Luo H, Zhang Y, Zhu J, Qin Y.   +5 more
europepmc   +1 more source

Room-temperature FeSi₂-doped Cu₂Se thermoelectric films with enhanced figure of merit. [PDF]

Sci Rep
Goto M, Sasaki M, Moronaga T, Hara T, Xu Y.   +4 more
europepmc   +1 more source

Cooler, stronger, smaller: improving thermoelectric cooling. [PDF]

Natl Sci Rev
Chauhan NS, Mori T.
europepmc   +1 more source

Some of the next articles are maybe not open access.

Related searches:

Bi2Te3 filaments via extrusion and pressureless sintering of Bi2Te3-based inks

MRS Communications, 2021
Inks containing sub-20 µm particles of doped bismuth telluride (n-type Bi2Te2.73Se0.3 or p-type (Bi0.5Sb1.5)Te3) are extruded into 330 µm diameter filaments. When solid-state sintered up to 857 K under no pressure, the filaments only partially densify, with over 20% porosity remaining.
Christoph Kenel, Nicholas R. Geisendorfer, Jun Peng, Matthew A. Grayson, David C. Dunand   +4 more
openaire   +1 more source

Liquation phenomena in Sn/Bi2Te3, In/Bi2Te3 and Cu/Bi2Te3 couples

Acta Materialia, 2020
Abstract Bi2Te3-based materials are the most commonly used materials in commercial thermoelectric devices. There are many joints in thermoelectric devices, thus knowledge of interfacial reactions with Bi2Te3 substrate is important. Interfacial reactions are examined in the following couples, Sn/Bi2Te3 at 160 °C, In/Bi2Te3 at 140 °C and Cu/Bi2Te3 at ...
Sinn-wen Chen, Yohanes Hutabalian, Zi-kai Hu, Hsu-hui Chen, Hao-wei Shih, Wei Wang   +5 more
openaire   +1 more source