Microstructure and Processing Performance of Brazed Diamond Micro-Powder Grinding Wheel with Ni-Based Filler Alloy. [PDF]
Wang S, Xiao H, Xiao B.
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Array-Patterned Anisotropic Conductive Films for High Precision Circuit Interconnection. [PDF]
Hao C +5 more
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Bonding Strength of the CFRP and AA6061 Joint Using Ascorbic Acid and Sodium Chloride Surface Treatment. [PDF]
Kang D, Kim J, Seong H, Yoon J, Jung S.
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Emerging Trends in Ultrasonic and Friction Stir Spot Welding of Polymers and Metal-Polymer Hybrids: A Review of Process Mechanics, Microstructure, and Joint Performance. [PDF]
Kumari K +5 more
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Enhancing Predictive Accuracy in Finite Element Analysis of Cement Augmentation: Methodological Considerations - A Commentary on "Biomechanical Impact of Cement Augmentation on Pedicle Screw Fixation and Adjacent Segment Disease in Multilevel Lumbar Fusion: A Finite Element Analysis". [PDF]
Mo F, He S.
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Joint Reply to `Maternal-Infant Bonding: A Joint Rebuttal'
Pediatrics, 1983To the Editor.— It is clear that there is some disagreement about the effects of early skin-to-skin contact, and these issues are discussed below. We want to underscore, however, that there is no disagreement about the laudable humanization of birthing practices that Klaus and Kennell helped bring about.
M E, Lamb +5 more
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Bonded Joints with Nonhomogeneous Adhesives
Journal of Elasticity, 1998zbMATH Open Web Interface contents unavailable due to conflicting licenses.
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Bonding strength in structural adhesive bonded joint
Metals and Materials International, 2001Adhesive bonding has emerged as a unique and highly developed joining process with applicability to a wide variety of engineering materials. Because the stresses of adhesive bonded joints are distributed much more uniformly than mechanical fasteners and many welds, they can be used to improve fatigue resistance and to join thin or fragile parts.
Jun Hee Song, Jae Kyoo Lim
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Abstract This article provides a discussion on adhesively bonded joints and elastic-plastic mathematical model for an adhesive in shear. It discusses the design rules for thin bonded structures and reviews computer programs for the highly loaded stepped-lap joints.
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