Results 211 to 220 of about 335,959 (267)
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Intramolecular hydrogen bonding analysis
The Journal of Chemical Physics, 2022The quasi-atomic orbital (QUAO) bonding analysis is used to study intramolecular hydrogen bonding (IMHB) in salicylic acid and an intermediate that is crucial to the synthesis of aspirin. The bonding analysis rigorously explores IMHB through directly accessing information that is intrinsic to the molecular wave function, thereby bypassing the need for ...
Taylor Harville, Mark S. Gordon
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Localized Bond Orbital Analysis of the Bonds of O2
The Journal of Physical Chemistry A, 2020A localized bond orbital analysis of the bonding in dioxygen and related species provides a unique fundamental insight into its bonding characteristics. It reveals the coalescence of the molecular orbital and valence bond/Lewis approaches and clearly demonstrates that the often stated inability of valence bond theory to describe the bonding of O2 is a ...
Thomas A. Corry, Patrick J. O’Malley
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Empirical analysis of bonding in ferrocenes
Journal of Organometallic Chemistry, 2006HeI and HeII photoelectron spectra (UPS) of 1-cyanomethyl, 1-butyryl and 1, 10-bis(dimethylsilyl)-ferrocene were measured. The nature of metal– ligand bonding was analyzed via regression analysis of UPS related experimental descriptors.
Novak, Igor, Kovač, Branka
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Bond Valence Analysis of BaRuO3
Journal of Solid State Chemistry, 2000Abstract The crystal structure of BaRuO3 has been derived by the bond valence method and sphere packing geometry using only the information obtained from the indexing of a powder pattern of the compound. The structural parameters derived in this way give calculated bond distances that agree with those measured experimentally to within 0.02 A.
Santoro, A. +2 more
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Analysis of Parasitic Effects by Bonding Structure
2021 International Conference on Electronics, Information, and Communication (ICEIC), 2021In this paper, a direct-bonded copper (DBC) substrate with wire-bonding and a DBC substrate with clip-bonding are designed and fabricated to compare inductance as their structure. Through a comparison of them, it is proved that the clip for the semiconductor package is suitable for decreasing inductance and direct current resistance (DCR).
Hyun Gyu Jang +6 more
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Stress Analysis for Bonded Layers
Journal of Applied Mechanics, 1974The problem of a line bond between two layers is solved by techniques appropriate to the plane theory of elasticity. Integral transforms are used to reduce the problem to singular integral equations. Numerical results are obtained for the case of identical layers and the numerical scheme of Erdogan and Gupta proved to be effective for this case. Stress-
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