Results 21 to 30 of about 940,670 (332)

A complementary view to the bonding pattern in the N5 +cation an electron localization function and local temperature analysis [PDF]

open access: yes, 2003
Indexación: ScieloThe electron localization function (ELF), a local measure of the Pauli repulsion effect, and the local Kohn-Sham temperature analysis, which is defined within the framework of a local thermodynamics description of density functional ...
Chamorro, E. (UNAB)
core   +1 more source

Parental bonding and alexithymia: A meta-analysis [PDF]

open access: yes, 2011
Aim: The primary purpose of this meta-analysis was to explore, clarify and report the strength of the relationship between alexithymia, as measured by the Toronto Alexithymia Scale (TAS-20), and parenting style as measured by the Parental Bonding ...
Lyvers, Michael   +3 more
core   +2 more sources

Cognitive complaints mediate childhood parental bonding influence on presenteeism.

open access: yesPLoS ONE, 2022
BackgroundChildhood parental bonding and cognitive complaints (CCs) affect a worker's mental health (MH), and CCs affect presenteeism. However, the impact of childhood parental bonding on presenteeism and the mediating effect of CCs with respect to the ...
Kuniyoshi Toyoshima   +6 more
doaj   +1 more source

Quantum coherence of the molecular states and their corresponding currents in nanoscale Aharonov-Bohm interferometers [PDF]

open access: yes, 2016
By considering a nanoscale Aharonov-Bohm (AB) interferometer containing a parrallel-coupled double dot coupled to the source and drain electrodes, we investigate the AB phase oscillations of transport current via the bonding and antibonding state ...
Liu, Jian-Heng   +2 more
core   +2 more sources

Modeling the Fracture Strength between Fused-Deposition Extruded Roads 16 [PDF]

open access: yes, 2000
The fracture strength developed between Fused-Deposition extruded roads is modeled in terms of the wetting and thermally-driven diffusion bonding processes.
Rodriguez, J. F., Thomas, J. P.
core   +1 more source

Bond Insertion at Distorted Si(001) Subsurface Atoms

open access: yesInorganics, 2018
Using density functional theory (DFT) methods, we analyze the adsorption of acetylene and ethylene on the Si(001) surface in an unusual bond insertion mode. The insertion takes place at a saturated tetravalent silicon atom and the insight gained can thus
Lisa Pecher, Ralf Tonner
doaj   +1 more source

The Comparison of the Bonding Performance between the new Flash-free Orthodontic Bracket Bonding System and the Traditional Bracket Bonding System: A Systematic Review and Meta-analysis [PDF]

open access: yesInternational Journal of Scientific Research in Dental and Medical Sciences, 2022
Background and aim: The purpose of this study was the comparison of the bonding performance between the new flash-free Orthodontic bracket bonding system and the traditional bracket bonding system.Material and methods: The present study is a systematic ...
Arkia Mardany   +5 more
doaj   +1 more source

A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N

open access: yesIEEE Journal of the Electron Devices Society, 2023
PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation.
Tzu-Heng Hung   +4 more
doaj   +1 more source

Analysis of Oxygen–Pnictogen Bonding with Full Bond Path Topological Analysis of the Electron Density [PDF]

open access: yesInorganic Chemistry, 2021
A variety of methods are available to investigate the bonding in inorganic compounds. In contrast to wavefunction-based analyses, topological analysis of the electron density affords the advantage of analyzing a physical observable: the electron density.
Brent Lindquist-Kleissler   +2 more
openaire   +5 more sources

Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding

open access: yesInternational Journal of Distributed Sensor Networks, 2021
Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds.
Wuwei Feng   +3 more
doaj   +1 more source

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