A complementary view to the bonding pattern in the N5 +cation an electron localization function and local temperature analysis [PDF]
Indexación: ScieloThe electron localization function (ELF), a local measure of the Pauli repulsion effect, and the local Kohn-Sham temperature analysis, which is defined within the framework of a local thermodynamics description of density functional ...
Chamorro, E. (UNAB)
core +1 more source
Parental bonding and alexithymia: A meta-analysis [PDF]
Aim: The primary purpose of this meta-analysis was to explore, clarify and report the strength of the relationship between alexithymia, as measured by the Toronto Alexithymia Scale (TAS-20), and parenting style as measured by the Parental Bonding ...
Lyvers, Michael +3 more
core +2 more sources
Cognitive complaints mediate childhood parental bonding influence on presenteeism.
BackgroundChildhood parental bonding and cognitive complaints (CCs) affect a worker's mental health (MH), and CCs affect presenteeism. However, the impact of childhood parental bonding on presenteeism and the mediating effect of CCs with respect to the ...
Kuniyoshi Toyoshima +6 more
doaj +1 more source
Quantum coherence of the molecular states and their corresponding currents in nanoscale Aharonov-Bohm interferometers [PDF]
By considering a nanoscale Aharonov-Bohm (AB) interferometer containing a parrallel-coupled double dot coupled to the source and drain electrodes, we investigate the AB phase oscillations of transport current via the bonding and antibonding state ...
Liu, Jian-Heng +2 more
core +2 more sources
Modeling the Fracture Strength between Fused-Deposition Extruded Roads 16 [PDF]
The fracture strength developed between Fused-Deposition extruded roads is modeled in terms of the wetting and thermally-driven diffusion bonding processes.
Rodriguez, J. F., Thomas, J. P.
core +1 more source
Bond Insertion at Distorted Si(001) Subsurface Atoms
Using density functional theory (DFT) methods, we analyze the adsorption of acetylene and ethylene on the Si(001) surface in an unusual bond insertion mode. The insertion takes place at a saturated tetravalent silicon atom and the insight gained can thus
Lisa Pecher, Ralf Tonner
doaj +1 more source
The Comparison of the Bonding Performance between the new Flash-free Orthodontic Bracket Bonding System and the Traditional Bracket Bonding System: A Systematic Review and Meta-analysis [PDF]
Background and aim: The purpose of this study was the comparison of the bonding performance between the new flash-free Orthodontic bracket bonding system and the traditional bracket bonding system.Material and methods: The present study is a systematic ...
Arkia Mardany +5 more
doaj +1 more source
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N
PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation.
Tzu-Heng Hung +4 more
doaj +1 more source
Analysis of Oxygen–Pnictogen Bonding with Full Bond Path Topological Analysis of the Electron Density [PDF]
A variety of methods are available to investigate the bonding in inorganic compounds. In contrast to wavefunction-based analyses, topological analysis of the electron density affords the advantage of analyzing a physical observable: the electron density.
Brent Lindquist-Kleissler +2 more
openaire +5 more sources
Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds.
Wuwei Feng +3 more
doaj +1 more source

