Results 31 to 40 of about 22,611,724 (309)
Parental bonding and alexithymia: A meta-analysis [PDF]
AbstractAimThe primary purpose of this meta-analysis was to explore, clarify and report the strength of the relationship between alexithymia, as measured by the Toronto Alexithymia Scale (TAS-20), and parenting style as measured by the Parental Bonding Instrument (PBI).MethodsWeb of Science, PsycInfo, PubMed and ProQuest: Dissertations and Theses ...
Thorberg, F. A. +3 more
openaire +5 more sources
Stochastic Damage Constitutive Relationship of Steel-Reinforced Concrete Bond-Slip
The bond-slip damage of the interface between profile steel and concrete is the key point of steel-reinforced concrete structure. This paper is based on the statistical analysis of a large amount of experimental data and the distribution characteristics ...
Ming Xie +4 more
doaj +1 more source
This study aimed to evaluate the failure rates and relevant factors of bonded orthodontic brackets with a computer-aided design and manufacturing (CAD/CAM)-based 3D-printed indirect bonding jig system (IDBS) using 2531 natural teeth selected from 99 ...
Jin Bai, Hye-Jin Lee, Seong-Hun Kim
doaj +1 more source
Cognitive complaints mediate childhood parental bonding influence on presenteeism.
BackgroundChildhood parental bonding and cognitive complaints (CCs) affect a worker's mental health (MH), and CCs affect presenteeism. However, the impact of childhood parental bonding on presenteeism and the mediating effect of CCs with respect to the ...
Kuniyoshi Toyoshima +6 more
doaj +1 more source
Dispersion-mediated steering of organic adsorbates on a precovered silicon surface
The chemistry of organic adsorbates on surfaces is often discussed in terms of Pauli repulsion as limiting factor regarding the packing of molecules. Here we show that the attractive part of the van der Waals potential can be similarly decisive.
Lisa Pecher +2 more
doaj +1 more source
Analysis of bonded elastic blocks
zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Banks, H. T., Pinter, G. A., Yeoh, O. H.
openaire +2 more sources
Reactive bonding and low temperature bonding of heterogeneous materials
S.307-318This paper describes alternative low-temperature bonding procedures in Microsytems Technology. On the one hand reactive bonding is introduced, which is a relatively new joining technique for the mounting of microelectric components and the ...
Wünsch, Dirk +3 more
core +1 more source
Low temperature fusion wafer bonding quality investigation for failure mode analysis
S.227-239In this paper, a brief summary of potential defect formation and failure characteristics for low temperature plasma-assisted Si wafer bonding in correlation to different influencing factors is given.
Siegert, J. +8 more
core +1 more source
Fifteen cyclic and acylic carbenes have been calculated with density functional theory at the BP86/def2-TZVPP level. The strength of the internal X→p(π) π-donation of heteroatoms and carbon which are bonded to the C(II) atom is estimated with the help of
Diego M. Andrada +3 more
doaj +1 more source
Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds.
Wuwei Feng +3 more
doaj +1 more source

