Results 31 to 40 of about 23,675,183 (257)
Dispersion-mediated steering of organic adsorbates on a precovered silicon surface
Beilstein Journal of Organic Chemistry, 2018 The chemistry of organic adsorbates on surfaces is often discussed in terms of Pauli repulsion as limiting factor regarding the packing of molecules. Here we show that the attractive part of the van der Waals potential can be similarly decisive.
Lisa Pecher +2 more
doaj +1 more source
Low temperature fusion wafer bonding quality investigation for failure mode analysis
, 2022 S.227-239In this paper, a brief summary of potential defect formation and failure characteristics for low temperature plasma-assisted Si wafer bonding in correlation to different influencing factors is given.
Siegert, J. +8 more
core +1 more source
Beilstein Journal of Organic Chemistry, 2015 Fifteen cyclic and acylic carbenes have been calculated with density functional theory at the BP86/def2-TZVPP level. The strength of the internal X→p(π) π-donation of heteroatoms and carbon which are bonded to the C(II) atom is estimated with the help of
Diego M. Andrada +3 more
doaj +1 more source
International Journal of Distributed Sensor Networks, 2021 Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds.
Wuwei Feng +3 more
doaj +1 more source
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N
IEEE Journal of the Electron Devices Society, 2023 PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation.
Tzu-Heng Hung +4 more
doaj +1 more source
The Comparison of the Bonding Performance between the new Flash-free Orthodontic Bracket Bonding System and the Traditional Bracket Bonding System: A Systematic Review and Meta-analysis [PDF]
International Journal of Scientific Research in Dental and Medical Sciences, 2022 Background and aim: The purpose of this study was the comparison of the bonding performance between the new flash-free Orthodontic bracket bonding system and the traditional bracket bonding system.Material and methods: The present study is a systematic ...
Arkia Mardany +5 more
doaj +1 more source
A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device
e-Polymers, 2023 This study presents a method for producing microfluidic chips from polypropylene using a pre-heated bonding area and thermal bonding technology. ANSYS was utilized to investigate the effects of bonding parameters and microchannel deformation and predict ...
Almezgagi Esam Abdulrahman +3 more
doaj +1 more source
Low temperature thermo compression bonding with printed intermediate bonding layers
, 2022 S.299-310The paper describes capabilities of additive material transfer technologies Aerosol Jet Printing (AJP), Stencil Printing (STP) and Screen Printing (SP) based on nano particle inks with the purpose of intermediate bond layer manufacturing for ...
Wiemer, Maik +5 more
core +1 more source
Fabrication of wafer-level thermocompression bonding
, 2002 Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300ºC via compressing gold under 7 MPa of pressure is described in detail.
Tsau, C.H. +2 more
core +1 more source
Reactive Bonding and Low Temperature Bonding of Heterogeneous Materials
, 2010 This paper describes alternative low-temperature bonding procedures in Microsytems Technology. On the one hand reactive bonding is introduced, which is a relatively new joining technique for the mounting of microelectric components and the hermetic ...
Dirk Wünsch +7 more
core +2 more sources