Results 31 to 40 of about 386,628 (313)

Bond Insertion at Distorted Si(001) Subsurface Atoms

open access: yesInorganics, 2018
Using density functional theory (DFT) methods, we analyze the adsorption of acetylene and ethylene on the Si(001) surface in an unusual bond insertion mode. The insertion takes place at a saturated tetravalent silicon atom and the insight gained can thus
Lisa Pecher, Ralf Tonner
doaj   +1 more source

A Quantum-Chemical Bonding Database for Solid-State Materials (JSONS: Part 2) [PDF]

open access: yes, 2023
This database consists of bonding data computed using Lobster for 1520 solid-state compounds consisting of insulators and semiconductors. The files are named as per ID numbers in the materials project database.
Benner, Phillip   +4 more
core   +1 more source

Cognitive complaints mediate childhood parental bonding influence on presenteeism.

open access: yesPLoS ONE, 2022
BackgroundChildhood parental bonding and cognitive complaints (CCs) affect a worker's mental health (MH), and CCs affect presenteeism. However, the impact of childhood parental bonding on presenteeism and the mediating effect of CCs with respect to the ...
Kuniyoshi Toyoshima   +6 more
doaj   +1 more source

Materials Integrations for High-Performance Photovoltaics by Wafer Bonding [PDF]

open access: yes, 2005
The fundamental efficiency limit for state of the art triple-junction photovoltaic devices is being approached. By allowing integration of non-lattice-matched materials in monolithic structures, wafer bonding enables novel photovoltaic devices that have ...
Zahler, James Michael
core   +1 more source

Dispersion-mediated steering of organic adsorbates on a precovered silicon surface

open access: yesBeilstein Journal of Organic Chemistry, 2018
The chemistry of organic adsorbates on surfaces is often discussed in terms of Pauli repulsion as limiting factor regarding the packing of molecules. Here we show that the attractive part of the van der Waals potential can be similarly decisive.
Lisa Pecher   +2 more
doaj   +1 more source

Chemical Bonding Analysis in Ti1-x-yAlxTayN Solid Solutions [PDF]

open access: yes, 2019
A comprehensive study of the evolution of electronic structure and chemical bonding in disordered Ti1-xAlxN and Ti1-x-y AlxTayN systems was performed by means of ab initio density functional theory calculations using crystal orbital Hamilton population ...
Sergey, Eremeev, A. R., Shugurov
core   +1 more source

Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding

open access: yesInternational Journal of Distributed Sensor Networks, 2021
Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds.
Wuwei Feng   +3 more
doaj   +1 more source

The Comparison of the Bonding Performance between the new Flash-free Orthodontic Bracket Bonding System and the Traditional Bracket Bonding System: A Systematic Review and Meta-analysis [PDF]

open access: yesInternational Journal of Scientific Research in Dental and Medical Sciences, 2022
Background and aim: The purpose of this study was the comparison of the bonding performance between the new flash-free Orthodontic bracket bonding system and the traditional bracket bonding system.Material and methods: The present study is a systematic ...
Arkia Mardany   +5 more
doaj   +1 more source

Analysis of bonded elastic blocks

open access: yesMathematical and Computer Modelling, 2002
zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Banks, H. T., Pinter, G. A., Yeoh, O. H.
openaire   +2 more sources

A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N

open access: yesIEEE Journal of the Electron Devices Society, 2023
PVD-deposited Cu3N has been demonstrated for Cu-Cu bonding as a low-cost passivation material. Cu3N exhibits stability at room temperature but undergoes decomposition upon heating, making it an attractive candidate for Cu bonding passivation.
Tzu-Heng Hung   +4 more
doaj   +1 more source

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